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A kind of conductive silver paste doped with silver salt and preparation method and application thereof

A technology of conductive silver glue and silver salt, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., and can solve the problems of weak adhesion, high cost, and low conductivity

Active Publication Date: 2019-03-29
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Therefore, in view of the relatively low electrical conductivity, poor cohesiveness, and high cost of the current conductive silver glue, it has become a priority to develop a relatively high electrical conductivity, strong cohesive and low-cost conductive silver glue. Technical problems that need to be solved urgently

Method used

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  • A kind of conductive silver paste doped with silver salt and preparation method and application thereof
  • A kind of conductive silver paste doped with silver salt and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0099] This embodiment provides a conductive silver glue doped with silver salt, which is prepared from the following raw materials:

[0100] 0.6 parts by weight of silver salt (silver nitrate);

[0101] 80 parts by weight of micron silver powder (mixing flaky rod-shaped silver powder, 5 microns of average particle diameter);

[0102] Epoxy resin (Shell bisphenol A type epoxy resin 828E) 17 parts by weight;

[0103] 1 part by weight of curing agent (dicyandiamide);

[0104] Accelerator (1-cyanoethyl-2-ethyl-4-methylimidazole) 0.1 parts by weight;

[0105] 0.1 parts by weight of coupling agent (KH-560);

[0106] Diluent (1,4-butanediol diglycidyl ether) 1.15 parts by weight;

[0107] Anti-precipitation agent (fumed silica) 0.05 parts by weight;

[0108] The preparation method of the above-mentioned conductive silver glue doped with silver salt comprises the following steps:

[0109] (1) Silver nitrate is filled in the epoxy resin according to the ratio, stirred and ground...

Embodiment 2

[0113] This embodiment provides a conductive silver glue doped with silver salt, which is prepared from the following raw materials:

[0114] 0.6 parts by weight of silver salt (silver nitrate);

[0115] 70 parts by weight of micron silver powder (mixing flaky rod-shaped silver powder, 5 microns of average particle diameter);

[0116] Epoxy resin (Shell bisphenol A type epoxy resin 828E) 25.0 parts by weight;

[0117] 1.4 parts by weight of curing agent (dicyandiamide);

[0118] Accelerator (1-cyanoethyl-2-ethyl-4-methylimidazole) 0.15 parts by weight;

[0119] 0.15 parts by weight of coupling agent (KH-560);

[0120] Diluent (1,4-butanediol diglycidyl ether) 2.63 parts by weight;

[0121] Anti-precipitation agent (fumed silica) 0.075 parts by weight;

[0122] The preparation method of the above-mentioned conductive silver glue doped with silver salt comprises the following steps:

[0123] (1) Silver nitrate is filled in the epoxy resin according to the ratio, stirred an...

Embodiment 3

[0127] This embodiment provides a conductive silver glue doped with silver salt, which is prepared from the following raw materials:

[0128] 0.6 parts by weight of silver salt (silver nitrate);

[0129] Micron silver powder (mixed flake rod-shaped silver powder, average particle diameter 5 microns) 60 parts by weight;

[0130] Epoxy resin (Shell bisphenol A type epoxy resin 828E) 34 parts by weight;

[0131] 2 parts by weight of curing agent (dicyandiamide);

[0132]Accelerator (1-cyanoethyl-2-ethyl-4-methylimidazole) 0.2 parts by weight;

[0133] 0.2 parts by weight of coupling agent (KH-560);

[0134] Diluent (1,4-butanediol diglycidyl ether) 2.9 parts by weight;

[0135] 0.1 parts by weight of anti-precipitation agent (fumed silica);

[0136] The preparation method of the above-mentioned conductive silver glue doped with silver salt comprises the following steps:

[0137] (1) Silver nitrate is filled in the epoxy resin according to the ratio, stirred and ground, so t...

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Abstract

Provided are a silver salt-doped conductive silver adhesive, and a preparation method and a use thereof. The silver salt-doped conductive silver adhesive is prepared and obtained from the following raw materials: 0.01-5 parts by weight of a silver salt, 50-85 parts by weight of a micron silver powder, 10-50 parts by weight of an epoxy resin, 0.5-60 parts by weight of a curing agent, 0.05-5 parts by weight of an accelerator, 0.05-5 parts by weight of a coupling agent, 1-10 parts by weight of a diluent and 0.05-2 parts by weight of an anti-precipitant. In the preparation method of the present invention, the silver salt is introduced into a formula of the conductive silver adhesive in a doping manner, so that the amount of the silver powder can be reduced by 15%-20% on the premise of ensuring the conductive performance of the conductive silver adhesive. When the addition amount of the silver powder is the same, the electrical conductivity of the conductive silver adhesive is greatly improved, and the conductive silver adhesive has a good shear strength and an aging resistance. The silver salt-doped conductive silver adhesive prepared and obtained can be widely applied to the following fields: solar cells, IC and LED packaging, etc.

Description

technical field [0001] The invention relates to a conductive silver glue doped with silver salt, a preparation method and application thereof, and belongs to the technical field of semiconductor materials and preparation thereof. Background technique [0002] As a substitute for traditional packaging materials in the field of electronic packaging—solder, conductive adhesive has many advantages, such as: environmental friendliness, no toxic metals, no need for pre-cleaning and post-soldering cleaning in the process; mild curing temperature, greatly reducing the impact on electronic devices Thermal damage and internal stress, especially suitable for heat-sensitive materials and non-solderable materials; high line resolution, and its line resolution below 200μm is more suitable for fine-pitch manufacturing. The many advantages of conductive adhesives adapt to the development trend of miniaturization, lightness and integration of electronic devices today, so it is widely used in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J163/00
CPCC09J9/02
Inventor 孙蓉韩延康张保坦朱朋莉李刚
Owner SHENZHEN INST OF ADVANCED TECH