Method for layout OPC (optical proximity correction)

Abstract

The invention provides a method for layout OPC (optical proximity correction). The method comprises the following steps of enabling a system to receive the layout data of an integrated circuit; enabling the system to divide the layout data of the integrated circuit into a plurality of initial layout graphs; enabling the system to determine a first graph density of each initial layout graph after cutting; enabling the system to call a second graph density when an OPC module is established; enabling the system to add a sub-resolution auxiliary graph onto the layout data according to the difference of first graph density and second graph density, so as to obtain new layout data; enabling the system to determine the new graph density of the new layout data after the sub-resolution graph is added; enabling the system to call the OPC module to perform OPC on the new layout data, and finally obtaining the final layout; enabling the system to splice the layout after OPC; enabling the system to store the whole spliced layout, and use as standby masking layout data.

Description

technical field [0001] The present invention relates to the field of semiconductor manufacturing, and more specifically, the present invention relates to a method for performing layout OPC (Optical Proximity Correction, optical proximity correction) processing. Background technique [0002] At present, large-scale integrated circuits are generally manufactured using photolithography systems. The lithography system is mainly divided into four systems: illumination system, mask, projection system and silicon wafer. The light emitted by the light source is focused by the condenser and then incident on the mask, and the opening part of the mask is light-transmitting; after passing through the mask, the light is incident on the silicon wafer coated with photoresist through the projection system, so that the mask pattern is copied on the wafer . [0003] The rapid development of computational optics makes large-scale integrated circuit technology a step forward. [0004] The pr...

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Problems solved by technology

[0015] Moreover, the general OPC software will take into account the mask plate and photoresist, the influence of the pattern size on the optical model to obtain the optical model, but it often does not take into account the relationship between the pattern density and light transmittance of the customer when establishing the initial optical processing device. There is a considerable difference in the layout data of different customers, which leads to a fixed optical model and graphics processing menu to deal with the layout of different customers. In this way, when the optical processing device has different processing effects on different layouts, it may cause problems. Weaken the actual processing effect of OPC (Optical Proximity Correction), which will further affect the performance of the device, and even cause certain yield loss and other problems

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