A 3D printing manufacturing method of a three-dimensional structure electronic device

A technology of electronic devices and three-dimensional structures, applied in the direction of multilayer circuit manufacturing, additive processing, etc., can solve the problems that cannot meet the requirements of the structural electronic device manufacturing of function-structure integration, and achieve the reduction of occupied space and environmental friendliness The effect of good and high mechanical properties

Active Publication Date: 2018-03-16
XI AN JIAOTONG UNIV
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Problems solved by technology

It can be seen that the existing process methods cannot meet the manufacturing requirements of structural electronic devices with functional-structural integration, and process innovation is needed to realize the manufacture of new three-dimensional structural electronic devices

Method used

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  • A 3D printing manufacturing method of a three-dimensional structure electronic device
  • A 3D printing manufacturing method of a three-dimensional structure electronic device
  • A 3D printing manufacturing method of a three-dimensional structure electronic device

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Embodiment Construction

[0023] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0024] A 3D printing manufacturing method for a three-dimensional structure electronic device, comprising the following steps:

[0025] 1) Refer to figure 1 , according to the performance requirements of the parts to be formed, design the spatial distribution of the circuit in the three-dimensional structure electronic device and the geometric size of the matrix structure, and establish a three-dimensional CAD model; process the model in layers according to the processing direction to obtain the material distribution of each layer section, Write the relative motion program of the print head integrated device 1 and the working platform 2;

[0026] 2) Select wire printing materials and matrix structure printing materials that meet the performance requirements. Wire printing materials are copper-tin alloys, silver-tin alloys, tin-lead alloys with low melting po...

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Abstract

A 3D printing manufacturing method of a three-dimensional structure electronic device. First, according to the performance requirements of the workpiece to be formed, the spatial distribution of the circuit in the three-dimensional structure electronic device and the geometric size of the matrix structure are designed, a three-dimensional CAD model is established, and the model is processed according to the processing direction. Layered processing, to obtain the material distribution of each layer section, write the relative motion program of the print head integrated device and the working platform, and then select the wire printing material and matrix structure printing material that meet the performance requirements, and then print the substrate, on the working platform Form the matrix structure, then switch the print head, print the wire, the movement mechanism drives the working platform to drop a layer thickness, repeat the printing process of printing the base material and printing wire, until the entire matrix structure and wire are printed, and the structural electronics are obtained. The invention realizes The synchronous printing of wires and base insulating medium can realize arbitrary arrangement in three-dimensional space.

Description

technical field [0001] The invention relates to the technical field of structural electronics manufacturing, in particular to a 3D printing manufacturing method of a three-dimensional structural electronic device. Background technique [0002] Structural electronics refers to a three-dimensional electrical structure in which circuits and electronic components are attached or embedded on a substrate structure according to a certain three-dimensional space layout. Its core features are: the electrical part has a three-dimensional spatial layout, which improves the space utilization rate and reduces the volume; the matrix structure has a three-dimensional shape, so that the structural electronics as a whole have certain mechanical properties. Taking advantage of these beneficial properties, structural electronics can be used to manufacture a large number of new electronic devices to realize the integration of function and structure, such as curved surface conformal electronic d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F3/00B22F5/00B29C67/06B33Y10/00H05K3/46B22F10/30B22F10/85B22F12/55
CPCH05K3/46B22F3/00B22F5/00B33Y10/00
Inventor 田小永尹丽仙
Owner XI AN JIAOTONG UNIV
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