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A parallel optical module

A technology of optical modules and lasers, applied in the direction of light guides, optics, optical components, etc., can solve the problems of poor assembly accuracy, poor heat dissipation effect, and low assembly efficiency of electrical connectors and optical connectors, and achieve small package size and reduced packaging Size, the effect of improving productivity

Active Publication Date: 2017-12-15
HISENSE & JONHON OPTICAL ELECTRICAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a parallel optical module to overcome the defects of low assembly efficiency, large package size, poor heat dissipation effect, poor assembly accuracy of electrical connectors and optical connectors existing in existing parallel optical modules

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Embodiment Construction

[0030] The specific embodiments of the present invention will be described in detail below, and it should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0031] like Figure 1-Figure 10 As shown, the parallel optical module of this embodiment includes a parallel optical assembly 1, and the parallel optical assembly 1 includes a PCB board 11, an electrical connector 12 and an optical connector 13 installed on the PCB board 11, and the optical connector 13 includes an FA fiber array assembly 131. VCSEL laser or PD detector 132 and drive chip 133, PCB board 11 includes rigid PCB board part 111 and flexible PCB board part 112, electrical connector 12 is arranged on rigid PCB board part 111; below flexible PCB board part 112 There is a metal reinforcing plate 14 parallel to the flexible PCB board part 112, and the metal reinforcing plate 14 is provided wi...

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Abstract

The invention discloses a parallel optical module, which comprises a parallel optical assembly, an upper cover, a base, and an MPO adaptor core. The parallel optical assembly utilizing the bending characteristics of a flexible PCB board part to make a rigid PCB board part and an electric connecter be arranged under the base, while a metal enhanced plate and an optical connector are arranged on the base, thus the overlapped installation of the parallel optical assembly on the base is realized, and the assembly precision of the optical connector and electric connector is guaranteed. The parallel optical assembly, the upper cover, the base, and the MPO adaptor core can be precisely positioned and assembled, thus the structure of the parallel optical module is compact, the encapsulation size is small, and the parallel optical module can be applied to a high density integrated communication system therefore. Furthermore, the heat source of the optical module is directly contacted with the base, so the parallel optical module has a good heat dissipation channel and a good heat dissipation characteristic, and the heat dissipation effect is improved.

Description

technical field [0001] The invention relates to the technical field of optical fiber communication, in particular to a parallel optical module. Background technique [0002] With the increasingly higher requirements for communication bandwidth in the field of optical fiber communication, the application of multi-channel parallel optical fiber transmission or parallel optical interconnection is becoming more and more extensive. In order to realize multi-channel parallel optical interconnection, multi-channel parallel optical transceiver modules are usually used Perform multiple parallel optical interconnections. [0003] Compared with single-channel modules, parallel modules require higher component density, smaller package size and weight, and lower energy consumption. At the same time, thermal design, electromagnetic interference shielding design, packaging process design, photoelectric coupling design and circuit design There are higher requirements. The perfect structur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42
CPCG02B6/4268G02B6/4281G02B6/4284G02B6/4285G02B6/4286G02B6/4296
Inventor 孙阳辉王永才姜瑜斐庄荣华
Owner HISENSE & JONHON OPTICAL ELECTRICAL TECH CO LTD