Low-pass filter based on TSV (Through-Silicon-Via) technology

Abstract

The invention relates to a filter, in particular to a low-pass filter based on TSV (Through-Silicon-Via) technology. The low-pass filter based on the TSV technology comprises a spiral inductance unit, a rewiring layer and a TSV component, wherein the spiral inductance unit comprises a spiral inductor I and a spiral inductor II, the rewiring layer comprises an input end, an output end, grounding metal, an interconnecting layer I and an interconnecting layer II, the TSV component comprises five coaxial through silicon vias of a through silicon via I, a through silicon via II, a through silicon via III, a through silicon via IV and a through silicon via V respectively which are the same in structure, and each coaxial through silicon via comprises a first dielectric layer, an outer metal layer, a second dielectric layer and a metal core layer in sequence from outside to inside; according to the invention, the coaxial through silicon vias are adopted to realize vertical capacitors, compared with the common plane structure capacitors, the occupied areas of the capacitors are greatly reduced, and the sizes of the devices are reduced to micron magnitudes, so that the circuit integration can be improved, and further the cost is reduced.

Description

technical field [0001] The invention belongs to filters, in particular to a low-pass filter based on silicon through hole technology. Background technique [0002] Today, mobile wireless devices such as smartphones, tablets, and ultrabooks have the advantages of miniaturization, high speed, and multiple functions. Moreover, these devices can also implement different communication standards. In order to solve these challenging requirements, system-in-package and system Advanced packaging technologies such as chip-level chip technology are rapidly developing to integrate communication systems into a small package; however, packaging traditional RF passive components such as filters, couplers, and antennas is quite difficult, mainly due to their bulky size, so the RF passives had to be moved out of the package and designed in PCB circuit board; and mounting these passive components requires a large PCB board area. [0003] In order to meet the design requirements of the filt...

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Problems solved by technology

[0002] Today, mobile wireless devices such as smartphones, tablets, and ultrabooks have the advantages of miniaturization, high speed, and multiple functions. Moreover, these devices can also implement different communication standards. In order to solve these challenging requirements, system-in-package and system Advanced packaging technologies such as chip-level chip technology are rapidly developing to integrate communication systems into a small package; however, packaging traditional RF passive components such as filters, couplers, and antennas is quite difficult, mainly due to their bulky size, so the RF passives had to be moved out of the package and designed in PCB circuit board; and mounting these passive components requires a large PCB Board area

[0003] In order to meet the design requirements of the filter, the footprint is small enough or even does not occupy PCB Board area requirements, the initial effort is to find materials with high dielectric constant, high quality factor and low frequency temperature coefficient, and this technology can only reduce the size of the device to the order of centimeters or millimeters, which is already very small, but with the integration of circuits With the continuous improvement of the degree, the technology cannot meet the requirements of the current integrated circuit

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