Single-crystal silicon-based nano-inverted pyramid-structured back-passivated solar cells
A nano-inverted pyramid and solar cell technology, which is applied in the field of solar cells, can solve the problems of low spectral response of battery devices, low external quantum efficiency of batteries, and general anti-reflection ability, etc., to improve short-wave spectral response, improve photoelectric conversion efficiency, The effect of excellent photoelectric performance
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Embodiment 1
[0033] Embodiment 1, with reference to figure 1 and figure 2 , a monocrystalline silicon-based nano-inverted pyramid structure back passivated solar cell: comprising a mono-crystalline silicon substrate 1, the front surface of the mono-crystalline silicon substrate 1 adopts a nano-inverted pyramid structure emitter 5, and the back surface of the mono-crystalline silicon substrate 1 A back passivation structure is adopted; the silicon nanometer inverted pyramid structure emitter 5 is composed of a silicon nanometer inverted pyramid structure and two passivation dielectric films.
[0034] Wherein, the back passivation structure adopts PECVD-SiO 2 / SiN x stack passivation. The side length of the opening on the silicon nanometer inverted pyramid structure is 700nm-900nm, and the depth is 800nm-1000nm.
[0035] In the two-layer passivation dielectric film: the inner passivation dielectric film is SiO deposited by PECVD 2 Thin film 2, with a thickness of 9nm-11nm; the outer pa...
Embodiment 2
[0037] Embodiment 2, in a kind of monocrystalline silicon-based nano-inverted pyramid structure back passivation solar cell described in embodiment 1:
[0038] The side length of the opening on the silicon nanometer inverted pyramid structure is 800nm, and the depth is 900nm. In the two-layer passivation dielectric film: the inner passivation dielectric film is SiO deposited by PECVD 2 Film 2, with a thickness of 10nm; the outer passivation dielectric film is SiN deposited by PECVD x Thin film 3 has a thickness of 70 nm. The back passivation structure consists of two passivation dielectric films, the inner passivation dielectric film is SiO deposited by PECVD 2 Film 8 with a thickness of 25nm; the outer passivation dielectric film is SiN deposited by PECVD x Thin film 7 has a thickness of 250 nm.
Embodiment 3
[0039] Embodiment 3, a kind of preparation method of monocrystalline silicon-based nano-inverted pyramid structure rear passivation solar cell, its steps are as follows:
[0040] (1) Silicon wafer preparation: use p-type surface-cut, solar-grade Cz silicon wafer as the substrate, and clean the silicon wafer with RCA standard process to obtain a single crystal silicon substrate;
[0041] (2) Preparation of nanoporous silicon: by HF, AgNO 3 、H 2 o 2 In the mixed solution, the nanoporous silicon structure is etched on the front surface of the single crystal silicon substrate by using MACE (metal-assisted chemical etching method), the etching time is 50 seconds to 70 seconds, and then HNO 3 solution to clean the residual silver; in the mixture: the concentration of HF is 1.9M-2.1M, AgNO 3 The concentration is 0.004M-0.006M, H 2 o 2 The concentration is 1.00M-1.10M;
[0042] (3) Preparation of nano-inverted pyramid structure: put the nano-porous silicon wafer into NaOH soluti...
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