Cu-Ga alloy sputtering target and method for manufacturing same

A sputtering target and alloy technology, applied in sputtering coating, metal processing equipment, metal material coating technology and other directions, can solve the problems of unstable high-power sputtering, etc., to eliminate the generation of target cracks and stabilize sputtering. radiation, reducing the effect of abnormal discharge

Active Publication Date: 2016-11-30
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For the voids, for example, when the porosity is only limited to 1.0% or less, if there are only tiny voids, even high-power sputtering can reduce the frequent occurrence of abnormal discharges, but if there are large voids, then It is easy to generate splash and abnormal discharge starting from the periphery of the hole
Therefore, in a sputtering target whose porosity is only controlled below 1.0%, high-power sputtering cannot be performed stably, especially when a large-area sputtering target is used.

Method used

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  • Cu-Ga alloy sputtering target and method for manufacturing same
  • Cu-Ga alloy sputtering target and method for manufacturing same
  • Cu-Ga alloy sputtering target and method for manufacturing same

Examples

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Embodiment

[0040] Next, the Cu—Ga alloy sputtering target of the present invention will be described more specifically by way of examples below.

[0041] [Example]

[0042] First, when producing the Cu-Ga alloy sputtering target of this invention, Cu-Ga alloy powder and pure copper powder were prepared. Cu—Ga alloy powders were produced by a gas atomization method after weighing Cu metal lumps and Ga metal lumps so that the Ga contents shown in Table 1 were obtained and melted in crucibles respectively. Examples 1 and 2 are for the case where the Cu-Ga alloy powder is used as the raw material powder, and Examples 3, 4, 8 to 12 are for mixing the above-mentioned Cu-Ga alloy powder and pure copper powder in the mixing ratio shown in Table 1. The case where powder is used as raw material powder. In this mixing, the rotation speed was set to 72 rpm, and the mixing time was set to 30 minutes, and it was performed with a rocking mixer. In addition, in Examples 5 to 7, Na compound was added ...

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Abstract

This Cu-Ga alloy sputtering target has a component composition containing 0.1-40.0% (atom basis) of Ga with the remainder made up by Cu and unavoidable impurities, wherein the porosity of the target is 3.0% or less, the average diameter of inscribed circles of the pores is 150 [mu]m or less, and the average crystal grain diameter of Cu-Ga alloy grains is 50 [mu]m or less.

Description

technical field [0001] The present invention relates to a Cu-Ga alloy sputtering target used for forming a Cu-In-Ga-Se compound film (hereinafter, sometimes abbreviated as CIGS film) used as a light absorbing layer of a thin-film solar cell and its production method. [0002] This application claims priority based on Patent Application No. 2014-140261 filed in Japan on July 8, 2014 and Patent Application No. 2015-123998 filed in Japan on June 19, 2015, and uses the contents thereof here. Background technique [0003] Various developments are being made on Cu-In-Ga-Se quaternary alloy films. A Cu-Ga alloy sputtering target is an essential material for manufacturing a solar cell using a Cu-In-Ga-Se quaternary alloy film (CIGS film) produced by a selenium (Se) method as a light absorbing layer. In addition, the so-called selenization method is, for example, H at 500°C 2 A method in which CuGa is sputtered to about 500 nm and then In is sputtered to about 500 nm is heated in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34B22F1/00C22C9/00C22C28/00C22F1/00B22F1/142
CPCC22C9/00C22C28/00B22F2998/10B22F2999/00C23C14/3414H01J37/3426B22F1/142B22F3/1017B22F2201/013B22F2201/04B22F2201/20B22F2201/016B22F2201/01C22F1/08B22F3/1007B22F3/14
Inventor 梅本启太张守斌
Owner MITSUBISHI MATERIALS CORP
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