Production method of low melting point spherical metal powder

A low-melting-point metal and production method technology, applied in the field of manufacturing metal powder or its suspension, can solve the problems of high oxygen content of metal micropowder, complex devices and methods, and high noise, and achieve low oxygen content, low noise, and low consumption. The effect of less energy
CN101985177AActive Publication Date: 2011-03-16SHENZHEN FITECH

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SHENZHEN FITECH
Publication Date
2011-03-16
Patent Text Reader

Abstract

A production method of low melting point spherical metal powder comprises the following working procedures: melting low melting point metal or alloy, mixing with hot oil, performing primary dispersion under pressure and inert gas, performing high-power ultrasonic dispersion and emulsification, performing filtering separation, etc. The production method of low melting point spherical metal powder is characterized by high production efficiency, narrow particle size distribution of the product, low oxygen content and no screening procedure. The method is suitable for the productions of the low melting point metal and alloy powder thereof of which liquid-phase temperatures are less than 300 DEG C, such as Pb-based alloy, Sn-based alloy, Sn-Zn based alloy or non-ferrous metals such as Bi, In and the like.
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Description

【Technical field】

[0001] The invention relates to the production of metal powder or its suspension, in particular to a production method of low-melting-point metal and its alloy spherical powder at a liquidus temperature below 300°C. 【Background technique】

[0002] Surface mount technology (SMT) is an electronic assembly technology that mounts various electronic components on printed circuit boards or substrates. It is the development of electronic products to high integration, high reliability, high precision and low cost. key. The solder paste with spherical low melting point metal powder as the main component is the key material of SMT. For precision electrical appliances such as mobile phones, MP3, and notebook computers, due to the development of the component pin spacing on electronic circuits to less than 0.2mm, solder paste is required. The spherical tin alloy powder has reached the standards of lead-free, miniaturization, low oxygen content and narrow particle size...

Claims

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