Production method of low melting point spherical metal powder
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- SHENZHEN FITECH
- Publication Date
- 2011-03-16
Abstract
Description
【Technical field】
[0001] The invention relates to the production of metal powder or its suspension, in particular to a production method of low-melting-point metal and its alloy spherical powder at a liquidus temperature below 300°C. 【Background technique】
[0002] Surface mount technology (SMT) is an electronic assembly technology that mounts various electronic components on printed circuit boards or substrates. It is the development of electronic products to high integration, high reliability, high precision and low cost. key. The solder paste with spherical low melting point metal powder as the main component is the key material of SMT. For precision electrical appliances such as mobile phones, MP3, and notebook computers, due to the development of the component pin spacing on electronic circuits to less than 0.2mm, solder paste is required. The spherical tin alloy powder has reached the standards of lead-free, miniaturization, low oxygen content and narrow particle size...