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LED substrate composite cooling material and production method thereof

A technology of composite heat-dissipating materials and LED substrates, applied in metal processing equipment, transportation and packaging, etc., can solve the problems of cost limitation and insufficient insulation performance, and achieve the effect of improving sintering performance, surface performance, good thermal conductivity and insulation performance

Inactive Publication Date: 2016-12-07
ANHUI BOLANGDAO AMUSEMENT EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing LED heat dissipation materials are mainly made of metal materials such as aluminum and copper. In actual use, there are disadvantages such as cost limitations and insufficient insulation performance. Therefore, it is necessary to improve the formula of the material to achieve a better heat dissipation effect. , improve the performance of the lamps and prolong the service life

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] The LED heat dissipation material of this embodiment is made of the following raw materials in parts by weight: aluminum 70, talc powder 8, magnesium 10, nano-silicon carbide 15, calcium fluoride 3, wollastonite powder 8, styrene 3, additive 5.

[0014] The auxiliary agent is made of the following raw materials in parts by weight: butyl stearate 5, cordierite powder 18, zirconium silicate 5, phosphotungstic acid 2, iron powder 8, the preparation method of the auxiliary agent is: first Dissolve phosphotungstic acid in an appropriate amount of water to prepare an aqueous solution with a concentration of 5%. Put cordierite powder into the solution, stir and disperse evenly, soak for 10 hours, filter, wash with water until neutral, and then dry. The obtained material is mixed with other remaining ingredients. and heated to 45-55°C, stirred and dispersed at constant temperature for 3 hours, cooled to room temperature, and then ground into 500-mesh fine powder to obtain the pr...

Embodiment 2

[0021] The LED heat dissipation material in this embodiment is made of the following raw materials in parts by weight: aluminum 60, talcum powder 7, magnesium 8, nano-silicon carbide 12, calcium fluoride 2, wollastonite powder 6, styrene 1, and additive 4.

[0022] The auxiliary agent is made of the following raw materials in parts by weight: butyl stearate 4, cordierite powder 15, zirconium silicate 4, phosphotungstic acid 1, iron powder 5, the preparation method of the auxiliary agent is: first Dissolve phosphotungstic acid in an appropriate amount of water to prepare an aqueous solution with a concentration of 4%. Put cordierite powder into the solution, stir and disperse evenly, soak for 8 hours, filter, wash with water until neutral, and then dry. The obtained material is mixed with other remaining ingredients. and heated to 45-55°C, stirred and dispersed at constant temperature for 2 hours, then cooled to room temperature, and then ground the material into 450 mesh fine p...

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PUM

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Abstract

The invention relates to a lamp cooling material, in particular to an LED substrate composite cooling material and a production method thereof. The composite cooling material is prepared from, by weight, 60-70 parts of aluminum, 7-8 parts of talcum powder, 8-10 parts of magnesium, 12-15 parts of nanometer silicon carbide, 2-3 parts of calcium fluoride, 6-8 parts of wollastonite in powder, 1-3 parts of styrene, and 4-5 parts of an assistant. The advantages of aluminum, magnesium, nanometer silicon carbide and the like are integrated, so that the composite cooling material has good heat conductivity and insulation performance, and the production cost is lowered; the surface performance of the wollastonite in powder modified through calcium fluoride and styrene is improved, and the wollastonite in powder can be compatible with other metal compositions more easily; and the assistant can improve the sintering performance of mixed materials, and the sintering time is shortened. The prepared composite cooling material is compact in structure, low in weight, insulating, high in heat conductivity, capable of effectively protecting an LED chip, and durable.

Description

technical field [0001] The invention relates to a heat dissipation material for a lamp, in particular to a composite heat dissipation material for an LED substrate and a production method thereof. Background technique [0002] LED is called the fourth-generation light source, which has the advantages of energy saving, environmental protection, safety, low energy consumption, and high brightness. It is widely used in daily life. The heat dissipation performance of the LED lamp itself is very important, which directly affects the service life of the lamp. and lighting effects. Existing LED heat dissipation materials are mainly made of metal materials such as aluminum and copper. In actual use, there are disadvantages such as cost limitations and insufficient insulation performance. Therefore, it is necessary to improve the formula of the material to achieve a better heat dissipation effect. , Improve the performance of lamps and prolong their service life. Contents of the i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F3/02B22F3/10
CPCB22F3/02B22F3/1007B22F2999/00B22F2998/10B22F1/10B22F2201/02
Inventor 陈加根
Owner ANHUI BOLANGDAO AMUSEMENT EQUIP