Positive photosensitive resin composition, pattern forming method and application thereof

A photosensitive resin and composition technology, applied in optics, optomechanical equipment, nonlinear optics, etc., can solve the problem that the pattern contrast and peelability of positive photosensitive resin compositions cannot meet the requirements of the industry.

Inactive Publication Date: 2020-01-03
CHI MEI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the aforementioned known technologies, the pattern contrast and peelability of the positive photosensitive resin composition can not meet the requirements of the industry.

Method used

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  • Positive photosensitive resin composition, pattern forming method and application thereof
  • Positive photosensitive resin composition, pattern forming method and application thereof
  • Positive photosensitive resin composition, pattern forming method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example A-1-1

[0111] A nitrogen inlet, a stirrer, a heater, a condenser tube and a thermometer are arranged on a four-necked conical flask with a volume of 1000 milliliters, and after introducing nitrogen, add 0.4 mole of m-cresol, 0.5 mole of p-cresol, 0.1 mole of 3 , 4-xylenol, 0.65 moles of formaldehyde and 0.2 moles of oxalic acid. Stir slowly to raise the temperature of the reaction solution to 100°C, and polycondense at this temperature for 6 hours. Then, the temperature of the reaction solution was raised to 180° C., and dried under reduced pressure at a pressure of 10 mmHg to obtain the xylenol-type novolac resin (A-1-1) after the solvent was devolatilized.

[0112] Synthesis Examples A-1-2 to A-1-6

[0113] Synthesis Examples A-1-2 to A-1-6 use the same preparation method as that of the xylenol-type novolak resin of Synthesis Example A-1-1, except that Synthesis Example A-1-2 To A-1-6 is to change the type and usage amount of raw materials in the novolac resin, and its formula is...

Synthetic example A-2-1

[0115] Set nitrogen inlet, stirrer, heater, condenser and thermometer on a four-necked conical flask with a volume of 1000 ml, add 0.7 mole m-cresol, 0.3 mole p-cresol, 0.7 mole formaldehyde after introducing nitrogen and 0.015 moles of oxalic acid. Stir slowly to raise the temperature of the reaction solution to 100°C, and polycondense at this temperature for 6 hours. Then, the reaction solution was heated up to 180° C., and dried under reduced pressure at a pressure of 10 mmHg, and the solvent was evaporated to obtain a hydroxyl-type novolac resin (A-2-1).

Synthetic example A-2-2

[0116] Synthesis Example A-2-2 and A-2-3

[0117] Synthesis Example A-2-2 and A-2-3 use the same preparation method as the synthetic method of the hydroxyl type novolak resin of Synthesis Example A-2-1, the difference is that Synthesis Example A-2-2 and A -2-3 is to change the type, usage amount and reaction temperature of the raw materials in the novolac resin. The formula and preparation conditions are shown in Table 1 respectively, and will not be repeated here.

[0118] Synthesis Comparative Example A-3-1

[0119] In a three-necked flask with a capacity of 500 ml, add 0.30 mole of methyltrimethoxysilane, 0.65 mole of phenyltrimethoxysilane, 0.05 mole of 3-(triethoxysilyl) propyl succinic anhydride and 200 grams of propylene glycol monoethyl ether, and added an aqueous oxalic acid solution (0.40 grams of oxalic acid / 75 grams of water) within 30 minutes while stirring at room temperature. Next, immerse the flask in an oil bath at 30°C and stir for 30 minutes, then raise th...

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Abstract

The present invention relates to a positive-type photosensitive resin composition comprising a novolac resin (A), an esterified product (B) of an o-naphthoquinonediazide sulfonic acid, an ethyl carbamate (methyl) acrylic ester compound (C) comprising at least six (meth) acryloyl groups per molecule, and a solvent (D). The present invention also relates to a method for forming a pattern through the positive-type photosensitive resin composition and its use in a thin film transistor array substrate and a liquid crystal display element. The above-mentioned positive-type photosensitive resin composition has good pattern contrast and releasability.

Description

technical field [0001] The present invention relates to a positive-type photosensitive resin composition and a pattern forming method thereof, and in particular to a liquid crystal display element or a touch panel used in a semiconductor integrated circuit element, a thin film transistor (hereinafter referred to as TFT). In manufacturing, a positive-type photosensitive resin composition with excellent pattern contrast and peelability and a method for forming a pattern using the composition. Background technique [0002] With the miniaturization of various electronic products in life, various smart phones, thin TVs and high-performance microprocessors are flooding our daily life, making the photolithography process more and more precise, and the formed line width is also getting wider and wider. It's getting finer. [0003] To meet the needs of different characteristics of photoresists, Japanese Patent Laid-Open No. 2010-20291 discloses a positive-type photosensitive resin c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/008G03F7/027G02F1/1362
CPCG02F1/1362G03F7/0085G03F7/027
Inventor 庄国平施俊安
Owner CHI MEI CORP
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