A manufacturing process for extended series of high-energy and wide-temperature tantalum capacitors
A tantalum capacitor and manufacturing process technology, which is applied in the field of extended series manufacturing process of high-energy and wide-temperature tantalum capacitors, can solve problems such as high production costs, economic losses, and circuit failures, so as to improve reliability, reduce leakage current values, and have a good market prospect Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0033] A high-energy wide-temperature capacitor manufacturing process, comprising the following steps:
[0034] (1) Adjust the pressing density D of the tantalum block: adjust the pressing density D of the tantalum block: D=0.5D0, D0 is the nominal pressing density;
[0035] (2) Heat treatment: application temperature: 300°C, time: 15min;
[0036] (3) Preparation of secondary forming liquid: specific formula: the volume ratio of ethylene glycol, phosphoric acid, and waterproof mixture is 70:1:8, and the waterproof mixture is prepared by mixing polypropylene glycol and resin according to the volume ratio of 10:7;
[0037] (4) Secondary formation at high temperature: the steps are:
[0038] ① Soak in forming solution for 1 hour at room temperature,
[0039] ②At a temperature of 150°C, start to boost the voltage at a rate of 3V / min,
[0040] ③Constant voltage for 2 hours after the boost reaches 1.2 times the rated voltage.
[0041] (5) Graded high-temperature aging: including...
Embodiment 2
[0049] A high-energy wide-temperature tantalum capacitor extended series manufacturing process, which includes the following steps:
[0050] (1) Adjust the pressing density D of the tantalum block: adjust the pressing density D of the tantalum block: D=0.68D0, D0 is the nominal pressing density;
[0051] (2) Heat treatment: application temperature: 340°C, time: 70min;
[0052] (3) Preparation of secondary forming liquid: specific formula: the volume ratio of ethylene glycol, phosphoric acid, and waterproof mixture is 75:2:9, and the waterproof mixture is prepared by mixing polypropylene glycol and resin according to the volume ratio of 15:12;
[0053] (4) Secondary formation at high temperature: the steps are:
[0054] ① Soak in forming solution for 1 hour at room temperature,
[0055] ②At a temperature of 155°C, start boosting at a rate of 3V / min,
[0056] ③Constant voltage for 2 hours after the boost reaches 1.2 times the rated voltage.
[0057] (5) Graded high-temperatu...
Embodiment 3
[0065] A high-energy wide-temperature tantalum capacitor extended series manufacturing process, which includes the following steps:
[0066] (1) Adjust the pressing density D of the tantalum block: adjust the pressing density D of the tantalum block: D=0.75D0, D0 is the nominal pressing density;
[0067] (2) Heat treatment: application temperature: 380°C, time: 120min;
[0068] (3) Preparation of secondary forming liquid: specific formula: the volume ratio of ethylene glycol, phosphoric acid, and waterproof mixture is 80:3:10, and the waterproof mixture is prepared by mixing polypropylene glycol and resin according to the volume ratio of 13:9;
[0069] (4) Secondary formation at high temperature: the steps are:
[0070] ① Soak in forming solution for 1 hour at room temperature,
[0071] ②At a temperature of 152°C, start boosting at a rate of 3V / min,
[0072] ③Constant voltage for 2 hours after the boost reaches 1.2 times the rated voltage.
[0073] (5) Graded high-temperat...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


