A Single-Stage Blocking Structure Narrow Bandpass UV Detector
A technology of ultraviolet detectors and blocking structures, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of not being able to solve the short-wave rejection ratio and reduce the quantum efficiency of detectors, so as to reduce dark current, improve performance, The effect of improving the shortwave rejection ratio
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Embodiment 1
[0045] The substrate 1 is a sapphire substrate.
[0046] The buffer layer 2 is grown on the sapphire substrate 1 and is a low-temperature epitaxial GaN material; the thickness of the buffer layer 2 is 30 nm.
[0047] The N-type ohmic contact layer 3 is fabricated on the buffer layer 2 and is an N-type GaN material with a high electron concentration, and the doping concentration is 1×10 18 cm -3 ; The thickness of the N-type ohmic contact layer 3 is 500nm.
[0048] The I-type absorbing layer 4 is fabricated on the N-type ohmic contact layer 3 and is an unintentionally doped N-type GaN material; the thickness of the I-type absorbing layer 4 is 500 nm.
[0049] The P-type single-stage barrier layer 5 is fabricated on the I-type absorber layer 4, which is P-type Al 0.3 Ga 0.7 N material, center doping concentration is 1×10 18 cm -3 ; The thickness of the P-type single-level barrier layer 5 is 60nm.
[0050] The P-type filter layer 6 is fabricated on the P-type single-stage ...
Embodiment 2
[0057] The substrate 1 is a sapphire substrate.
[0058] The buffer layer 2 is grown on the sapphire substrate 1 and is a low-temperature epitaxial GaN material; the thickness of the buffer layer 2 is 30 nm.
[0059] The N-type ohmic contact layer 3 is fabricated on the buffer layer 2 and is an N-type GaN material with a high electron concentration, and the doping concentration is 2×10 18 cm -3 ; The thickness of the N-type ohmic contact layer 3 is 2000nm.
[0060] The I-type absorbing layer 4 is fabricated on the N-type ohmic contact layer 3 and is an unintentionally doped N-type GaN material; the thickness of the I-type absorbing layer 4 is 500 nm.
[0061] The P-type single-stage barrier layer 5 is fabricated on the I-type absorber layer 4, which is P-type Al 0.3 Ga 0.7 N material, center doping concentration is 1×10 18 cm -3 ; The thickness of the P-type single-level barrier layer 5 is 60nm.
[0062] The P-type filter layer 6 is fabricated on the P-type single-stage...
Embodiment 3
[0069] The substrate 1 is a sapphire substrate.
[0070] The buffer layer 2 is grown on the sapphire substrate 1 and is a low-temperature epitaxial GaN material; the thickness of the buffer layer 2 is 30 nm.
[0071] The N-type ohmic contact layer 3 is fabricated on the buffer layer 2, and is an N-type GaN material with a high electron concentration, and the doping concentration is 5×10 18 cm -3 ; The thickness of the N-type ohmic contact layer 3 is 4000nm.
[0072] The I-type absorbing layer 4 is fabricated on the N-type ohmic contact layer 3 and is unintentionally doped N-type Al 0.1 Ga 0.9 N material; the thickness of the I-type absorbing layer 4 is 500nm.
[0073] The P-type single-stage barrier layer 5 is fabricated on the I-type absorber layer 4, which is P-type Al 0.4 Ga 0.6 N material, center doping concentration is 1×10 18 cm -3 ; The thickness of the P-type single-level barrier layer 5 is 60nm.
[0074] The P-type filter layer 6 is fabricated on the P-type s...
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