A Narrow Bandpass UV Detector with Unipolar Blocking Structure
一种紫外探测器、阻挡结构的技术,应用在半导体器件、电气元件、电路等方向,能够解决降低探测器量子效率、不能很好的解决短波抑制比等问题,达到降低暗电流、提高性能、提高短波抑制比的效果
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Embodiment 1
[0045] The substrate 1 is a sapphire substrate.
[0046] The buffer layer 2 is grown on the sapphire substrate 1 and is a low-temperature epitaxial GaN material; the thickness of the buffer layer 2 is 30 nm.
[0047] The N-type ohmic contact layer 3 is fabricated on the buffer layer 2 and is an N-type GaN material with a high electron concentration, and the doping concentration is 1×10 18 cm -3 ; The thickness of the N-type ohmic contact layer 3 is 500nm.
[0048] The I-type absorbing layer 4 is fabricated on the N-type ohmic contact layer 3 and is an unintentionally doped N-type GaN material; the thickness of the I-type absorbing layer 4 is 500 nm.
[0049] The P-type unipolar barrier layer 5 is fabricated on the I-type absorber layer 4, which is P-type Al 0.3 Ga 0.7 N material, center doping concentration is 1×10 18 cm -3 ; The thickness of the P-type unipolar barrier layer 5 is 60nm.
[0050] The P-type filter layer 6 is fabricated on the P-type unipolar barrier laye...
Embodiment 2
[0057] The substrate 1 is a sapphire substrate.
[0058] The buffer layer 2 is grown on the sapphire substrate 1 and is a low-temperature epitaxial GaN material; the thickness of the buffer layer 2 is 30 nm.
[0059] The N-type ohmic contact layer 3 is fabricated on the buffer layer 2 and is an N-type GaN material with a high electron concentration, and the doping concentration is 2×10 18 cm -3 ; The thickness of the N-type ohmic contact layer 3 is 2000nm.
[0060] The I-type absorbing layer 4 is fabricated on the N-type ohmic contact layer 3 and is an unintentionally doped N-type GaN material; the thickness of the I-type absorbing layer 4 is 500 nm.
[0061] The P-type unipolar barrier layer 5 is fabricated on the I-type absorber layer 4, which is P-type Al 0.3 Ga 0.7 N material, center doping concentration is 1×10 18 cm -3 ; The thickness of the P-type unipolar barrier layer 5 is 60nm.
[0062] The P-type filter layer 6 is fabricated on the P-type unipolar barrier lay...
Embodiment 3
[0069] The substrate 1 is a sapphire substrate.
[0070] The buffer layer 2 is grown on the sapphire substrate 1 and is a low-temperature epitaxial GaN material; the thickness of the buffer layer 2 is 30 nm.
[0071] The N-type ohmic contact layer 3 is fabricated on the buffer layer 2, and is an N-type GaN material with a high electron concentration, and the doping concentration is 5×10 18 cm -3 ; The thickness of the N-type ohmic contact layer 3 is 4000nm.
[0072] The I-type absorbing layer 4 is fabricated on the N-type ohmic contact layer 3 and is unintentionally doped N-type Al 0.1 Ga 0.9 N material; the thickness of the I-type absorbing layer 4 is 500nm.
[0073] The P-type unipolar barrier layer 5 is fabricated on the I-type absorber layer 4, which is P-type Al 0.4 Ga 0.6 N material, center doping concentration is 1×10 18 cm -3 ; The thickness of the P-type unipolar barrier layer 5 is 60nm.
[0074] The P-type filter layer 6 is fabricated on the P-type unipolar ...
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