High thermal conductive polyimide/boron nitride composite material and preparation method thereof
A technology of polyimide and composite materials, which is applied in the field of high thermal conductivity polyimide/boron nitride composite materials and its preparation, can solve the problem of limited improvement of thermal conductivity of composite materials, inability to form a thermal conductivity network, and boron nitride agglomeration Serious problems, to achieve the effect of being suitable for industrial production, simple and practical molding method, and avoiding the influence of thermal stability
Active Publication Date: 2016-12-21
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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Abstract
The invention discloses a preparation method of a high thermal conductive polyimide/boron nitride composite material. The method comprises the steps of: (1) dispersing polyimide microspheres with boron nitride into a solvent respectively to obtain a uniform polyimide microsphere dispersion and a boron nitride dispersion; (2) adding the boron nitride dispersion into the polyimide microsphere dispersion, performing stirring, then conducting centrifugation and collecting polyimide/boron nitride composite microspheres; and (3) subjecting the polyimide/boron nitride composite microspheres to compression molding, thus obtaining the high thermal conductive polyimide/boron nitride composite material. The invention also discloses the high thermal conductive polyimide/boron nitride composite material prepared by the method, and the composite material comprises, by mass percentage, 50-90% of polyimide microspheres and 10-50% of boron nitride. According to the invention, a three-dimensional ordered boron nitride heat conducting network is constructed inside the polyimide/boron nitride composite material to greatly improve the thermal conductivity of the composite material.
Application Domain
Heat-exchange elements
Technology Topic
SolventThermal conductivity +6
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PUM
Property | Measurement | Unit |
The average particle size | 1.0 | µm |
Thickness | 1.0 | mm |
Thermal conductivity | 1.269 | W/mK |
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