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High thermal conductive polyimide/boron nitride composite material and preparation method thereof

A technology of polyimide and composite materials, which is applied in the field of high thermal conductivity polyimide/boron nitride composite materials and its preparation, can solve the problem of limited improvement of thermal conductivity of composite materials, inability to form a thermal conductivity network, and boron nitride agglomeration Serious problems, to achieve the effect of being suitable for industrial production, simple and practical molding method, and avoiding the influence of thermal stability

Active Publication Date: 2016-12-21
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the surface chemical modification of boron nitride has a limited effect on improving the thermal conductivity of composite materials. Due to heat conduction network

Method used

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  • High thermal conductive polyimide/boron nitride composite material and preparation method thereof
  • High thermal conductive polyimide/boron nitride composite material and preparation method thereof
  • High thermal conductive polyimide/boron nitride composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] (1) Add 0.54g of self-made polyimide microspheres to 54g of water, stir and disperse evenly to obtain a dispersion of polyimide microspheres; add 0.06g of boron nitride to 6g of water, and ultrasonically disperse for 1 hour to obtain nitrided boron dispersion.

[0061] (2) Slowly add the boron nitride dispersion into the polyimide microsphere dispersion, and stir for 1 h at 25°C to obtain polyimide / boron nitride composite microspheres, and the scanning electron microscope image of the resulting composite microspheres Such as figure 2 (B) shown.

[0062] (3) Put the polyimide / boron nitride composite microspheres in the mold, hold the pressure at 230°C and 1000MPa pressure for 1h, and obtain a polyimide / boron nitride composite material with a thickness of about 1mm, which is composed of The mass percentage is composed of 90% polyimide microspheres and 10% boron nitride, and the scanning electron microscope picture of the cross section of the composite material is as fo...

Embodiment 2

[0067] (1) Add 0.48g of self-made polyimide microspheres to 48g of water, stir and disperse evenly to obtain a dispersion of polyimide microspheres; add 0.12g of boron nitride to 12g of water, and ultrasonically disperse for 1 hour to obtain a nitrided boron dispersion.

[0068] (2) Slowly add the boron nitride dispersion into the polyimide microsphere dispersion, and stir for 3 hours at 25°C to obtain polyimide / boron nitride composite microspheres, and the scanning electron microscope image of the resulting composite microspheres Such as figure 2 (C) shown.

[0069] (3) Put the polyimide / boron nitride composite microspheres in the mold, hold the pressure at 230°C and 1000MPa pressure for 1h, and obtain a polyimide / boron nitride composite material with a thickness of about 1mm, which is composed of The mass percentage is 80% polyimide microspheres and 20% boron nitride composition, and the scanning electron microscope picture of the composite material section of gained is a...

Embodiment 3

[0072] (1) Add 0.42g of self-made polyimide microspheres to 42g of water, stir and disperse evenly to obtain a dispersion of polyimide microspheres; add 0.18g of boron nitride to 18g of water, and ultrasonically disperse for 1 hour to obtain a nitrided boron dispersion.

[0073] (2) Slowly add the boron nitride dispersion into the polyimide microsphere dispersion, and stir at 25°C for 0.5h to obtain polyimide / boron nitride composite microspheres, and the scanning electron microscope of the obtained composite microspheres Figure such as figure 2 (D) shown.

[0074] (3) Put the polyimide / boron nitride composite microspheres in the mold, hold the pressure at 230°C and 1000MPa pressure for 1h, and obtain a polyimide / boron nitride composite material with a thickness of about 1mm, which is composed of The mass percent is 70% polyimide microspheres and 30% boron nitride composition, and the scanning electron microscope picture of the cross-section of the composite material is as f...

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Abstract

The invention discloses a preparation method of a high thermal conductive polyimide / boron nitride composite material. The method comprises the steps of: (1) dispersing polyimide microspheres with boron nitride into a solvent respectively to obtain a uniform polyimide microsphere dispersion and a boron nitride dispersion; (2) adding the boron nitride dispersion into the polyimide microsphere dispersion, performing stirring, then conducting centrifugation and collecting polyimide / boron nitride composite microspheres; and (3) subjecting the polyimide / boron nitride composite microspheres to compression molding, thus obtaining the high thermal conductive polyimide / boron nitride composite material. The invention also discloses the high thermal conductive polyimide / boron nitride composite material prepared by the method, and the composite material comprises, by mass percentage, 50-90% of polyimide microspheres and 10-50% of boron nitride. According to the invention, a three-dimensional ordered boron nitride heat conducting network is constructed inside the polyimide / boron nitride composite material to greatly improve the thermal conductivity of the composite material.

Description

technical field [0001] The invention belongs to the field of polymer composite materials, and in particular relates to a high thermal conductivity polyimide / boron nitride composite material and a preparation method thereof. Background technique [0002] With the trend of electronic products becoming lighter, thinner and more mobile, the packaging density of electronic products is becoming more and more integrated. In addition, the demand for functions is getting higher and higher, the required driving power is also increasing, and the heat generated by the system is also rising linearly. How to maintain the stable operation of the electronic product system through good heat dissipation will become the key. [0003] Polyimide (PI) is a class of aromatic polymers containing imide rings. It has the characteristics of high temperature resistance, corrosion resistance and excellent mechanical properties. It is widely used in microelectronic devices, aerospace, automobile manufact...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L29/04C08K3/38C09K5/14B29C43/02
CPCB29C43/02C08K2201/003C08L79/08C08L2203/30C09K5/14C08L29/04C08K2003/385
Inventor 徐禄波王玮陈国飞方省众
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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