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Thermally conductive silicone putty constituent

A technology of silicone oil and thermal conductivity, applied in the field of thermal conductive silicone putty composition, can solve the problems of misoperation of components, low viscosity, inability to fully remove heat, etc., and achieve the effect of improving offset resistance

Active Publication Date: 2016-12-21
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of mass production such as screen printing, the viscosity of the paste should be low. In this case, heat removal cannot be sufficiently performed due to displacement (pumping phenomenon) of the paste due to thermal shock of components, etc. As a result, components sometimes malfunction
[0005] In addition, the following proposals have been proposed as conventional technologies, but none of them have achieved sufficient performance

Method used

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  • Thermally conductive silicone putty constituent
  • Thermally conductive silicone putty constituent
  • Thermally conductive silicone putty constituent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5、 comparative example 1～10

[0080] As shown in Tables 1, 2, and 3, each component was put into a planetary mixer (numbers in the table indicate g), and uniformly mixed at 25° C. for 30 minutes to prepare a heat-conductive putty composition. Using the obtained composition, various tests described above were performed. The results are described in Tables 1, 2, and 3 together. In addition, the components (A)-(F) used are as follows.

[0081] ingredient (A)

[0082] (A-1)

[0083] Both ends are capped with trimethylsilyl groups, linear, kinematic viscosity 1,000mm 2 / s of dimethyl polysiloxane.

[0084] (A-2)

[0085] Both ends are terminated with trimethylsilyl groups, linear, kinematic viscosity 5,000mm 2 / s of dimethyl polysiloxane.

[0086] (A-3)

[0087] 【Chemical 3】

[0088]

[0089] ingredient (B)

[0090] (B-1)

[0091] A dimethyl polysiloxane raw rubber having a vinyl group at both terminals and having an absolute viscosity at 25°C of 11,000 mPa·s at 30% by mass in xylene was dissol...

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Abstract

The invention relates to a thermally conductive silicone putty composition comprising following constituents (A)-(D): (A) an organopolysiloxane having a kinematic viscosity of 10 to 100,000 mm2 / s at 25 DEG C represented by the following formula (1); (B) an organopolysiloxane raw rubber having an absolute viscosity of 5,000 to 40,000 mPa*s at 25 DEG C when 30% by mass of an organopolysiloxane which is soluble in xylene is dissolved in xylene; (C) an aluminum hydroxide powder having an average particle diameter of 0.5 to 10 [mu]m; (D) an inorganic compound powder selected from the group consisting of aluminum powder, zinc oxide powder, alumina powder, boron nitride powder and aluminum nitride powder, having an average particle diameter of 0.5 to 100 [mu]m. Although the composition of the present invention has fluidity, it is possible to see a significant increase in offset resistance. R1aSiO(4-a) / 2 (1) R1 is one or more groups selected from the group consisting of saturated or unsaturated monovalent hydrocarbon groups having 1 to 18 carbon atoms, wherein 1.8<=a<=2.2].

Description

technical field [0001] The present invention relates to a thermally conductive silicone putty composition excellent in offset resistance. Background technique [0002] In general, electrical and electronic components generate heat during use, and thus heat removal is required for proper operation of the electrical components, and various heat conductive materials for heat removal have been proposed. The thermally conductive material generally has two types: 1) a sheet-like thermally conductive material that is easy to handle, and 2) a paste-like thermally conductive material. [0003] A sheet-like thermally conductive material has the advantages of being easy to handle and excellent in stability, but since the thermal contact resistance is substantially amplified, heat release performance is inferior to that of a paste-like thermally conductive material. In addition, in order to maintain the sheet shape, a certain degree of strength and rigidity are required, and the tolera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/07C08L83/06C08K3/22C08K3/38C08K3/28
CPCC08L83/04C08L2205/03C08L2205/025C08K2201/003C08L83/06C08K2003/2227C08K2003/2296C08K2003/385C08K2003/282
Inventor 山田邦弘
Owner SHIN ETSU CHEM IND CO LTD
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