Air-cooled heat dissipation structure and manufacturing method based on three-dimensional stacked package

Abstract

The invention relates to an air cooling radiating structure on the basis of three-dimensional stacked packaging and a method for manufacturing the air cooling radiating structure. The air cooling radiating structure comprises a plurality of layers of substrates. The substrates are sequentially stacked on a PCB (printed circuit board), chips are arranged on the front surfaces of each layer of substrates, tiny bumps of the chips are connected with a welding pad on the front surfaces of the substrates, and BGA (ball grid array) welded balls are formed on a welding pad on the back surfaces of the substrates. The air cooling radiating structure is characterized in that through holes are formed in each layer of substrates except for the bottommost layer of substrates, and the front surfaces and the back surfaces of the corresponding substrates are communicated with one another via the through holes. Through holes are formed in the bottommost layer of substrates. The through holes in the upper and lower layers of substrates are formed in locations consistent with one another in the vertical directions. The number of the stacking layers of the substrates can be 2 or 3 or more. The chips are bare chips or packaged chips. The substrates are organic substrates or ceramic substrates or Si connection plates. The corresponding through holes are formed in the center of each substrate or in two sides of the substrate. The air cooling radiating structure and the method have the advantages that processes for the air cooling radiating structure are simple, the air cooling radiating structure is low in manufacturing cost, the temperatures can be reduced to a great extent, and heat of the multiple layers of stacked chips can be effectively radiated.

Description

technical field [0001] The invention relates to an air-cooled heat dissipation structure and a manufacturing method based on a three-dimensional stack package, and belongs to the technical field of microelectronic packaging. Background technique [0002] Three-dimensional packaging can significantly reduce signal interconnect delay, improve chip integration, and reduce chip cost. It is the future development direction of the integrated circuit field. However, with the improvement of chip integration, the heat generated during the working process of the chip tends to be concentrated in the package, and it is difficult to dissipate it effectively. At present, the problem of heat dissipation is one of the main reasons restricting the development of three-dimensional packaging. Traditional heat dissipation methods such as heating sinks, air cooling, and liquid cooling can reduce the temperature on the surface of the package, but it is difficult to effectively dissipate the heat ...

AI Technical Summary

Problems solved by technology

[0004] (1) Reliability issues: Due to the presence of cooling agent, there may be problems such as cooling agent volatilization, cooling agent leakage, and corrosion of solder balls by the cooling agent, and the chip will work in the cooling agent for a long time, and the chip will also be electrically damaged. failure of

[0005] (2) In the body of the three-dimensional package, it is necessary to install the shell seal, flow meter, mechanical pump, etc., which not only increases the volume, but also increases the cost

[0006] (3) The assembly process is complicated and the realizability is not high

[0008] (1) Due to the limitation of the heat conduction path, the heat generated on the chip can be evenly distributed to the carrier board, but the heat still cannot be effectively discharged inside the package, and the heat problem of the stacked chip has not been fundamentally solved, and the middle layer chip will still overheat

[0009] (2) By increasing the metal heat sink and protruding out of the package, although the heat dissipation area can be increased, but at the same time it brings an increase in volume, and the convection coefficient under natural convection is too small, the heat dissipation of this structure under natural convection no significant effect

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