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Formula and preparation technology of water-soluble phenolic resin glue

A technology of water-soluble phenolic resin and production process, which is applied in the direction of adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., and can solve the problems of low production efficiency, high curing temperature and slow curing speed of phenolic resin adhesives, etc. problems, to achieve the effect of convenient production, easy promotion of production, and changing the complexity of the production process

Inactive Publication Date: 2017-02-08
李芹
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing phenolic resin adhesives have disadvantages such as deep color, hard and brittle adhesive layer after curing, easy cracking, and higher cost than urea-formaldehyde resin adhesives; especially phenolic resin adhesives have high curing temperature and slow curing speed (generally at 130~ Good bonding strength can only be obtained by hot pressing at 160°C), resulting in low production efficiency, high energy and equipment consumption

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Example 1, 100g of phenol, 20g of sodium hydroxide solution (30%), 180g of formaldehyde solution (37%), and 20g of water.

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PUM

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Abstract

The invention discloses a formula and a preparation technology of water-soluble phenolic resin glue. The formula comprises 30-35% of phenol, 6-10% of a sodium hydroxide solution, 50-55% of a formaldehyde solution and 7-12% of distilled water. The preparation technology comprises 1, raw material selection, 2, raw material stirring and homogenization, 3, heating backflow, 4, water cooling, and 5, glue curing formation. The formula and the preparation technology of the water-soluble phenolic resin glue solves the problem that the existing water-soluble phenolic resin glue preparation process is complex and has low technical curing efficiency, is convenient for preparation and can be easily promoted and prepared.

Description

technical field [0001] The invention relates to the technical field of herbicide production, in particular to a production formula and a production process of a water-soluble phenolic resin adhesive. Background technique [0002] Since the reform and opening up, my country's adhesive industry has developed very rapidly. At present, there are various varieties and relatively complete categories. Among them, the largest output is still trialdehyde adhesives (phenolic, urea-formaldehyde, and melamine-formaldehyde) and emulsion adhesives. The two account for 45.2% of the total output respectively. % and 29 2%, synthetic adhesives have accounted for 1% of the country's total chemical output value. In terms of market application, the construction industry consumes the largest amount, accounting for about 51.8% of the total amount of glue, followed by the paper packaging industry, accounting for about 12.6% of the total amount of glue, and the third is the shoe industry, accounting ...

Claims

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Application Information

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IPC IPC(8): C08G8/10C09J161/10
CPCC08G8/10C09J161/06
Inventor 李芹
Owner 李芹