Laser light source system and display apparatus
A laser light source and laser technology, applied in laser devices, semiconductor laser devices, optics, etc., can solve the problems of complex structure and high cost, and achieve the effects of reducing coherence, low cost, and suppressing speckle
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[0066] Example one
[0067] The embodiment of the present invention provides a laser light source system structure, Figure 3a Illustratively shows a structural block diagram of a laser light source system to which the embodiment of the present invention is applicable. Such as Figure 3a As shown, it includes: a laser 301, a heat sink 302, and a homogenizer 303.
[0068] Such as Figure 3a As shown, the laser 301 includes N laser chips, and N is an integer greater than or equal to 1; the N laser chips are arranged on the heat sink 302, and the thermal conductivity of at least two laser chips in the heat sink 302 is different; The laser beams emitted by the N laser chips are incident on the homogenizer 303.
[0069] The emission color of the laser 301 is not limited here, and it can be one or any combination of a red laser, a green laser, and a blue laser. The number of heat sinks 302 is also not limited, and it can be one or more heat sinks. The material of the heat sink 302 can b...
Example Embodiment
[0075] Example two
[0076] In the following, the number of heat sinks 302 is taken as an example to describe the laser structure of the embodiment of the present invention in detail.
[0077] In this embodiment, the number of heat sink 302 is one, and the heat sink 302 can be divided into N regions, where at least two of the N regions have different thermal conductivity, and a laser chip is arranged in one region of the heat sink 302 . By packaging the laser chips on different parts of the heat sink, due to the difference in thermal conductivity between different parts, there is a temperature difference between the laser chips, and a broadband visible light output is generated to reduce the laser coherence.
[0078] In order to cause a large temperature difference between the laser chips, preferably, the thermal conductivity of the N areas of the heat sink increases linearly or decreases linearly according to the arrangement order of the N areas of the heat sink.
[0079] Figure 4a...
Example Embodiment
[0088] Example three
[0089] Hereinafter, taking N heat sinks 302 as an example, the laser structure of the embodiment of the present invention will be described in detail.
[0090] In the embodiment of the present invention, the number of heat sinks 302 is N, at least two of the N heat sinks have different thermal conductivity, and one laser chip is arranged on one heat sink. By encapsulating N laser chips on N heat sinks, the thermal conductivity of the N heat sinks is different, so that there is a temperature difference between the laser chips, and a broadband visible light output is generated to reduce the laser coherence.
[0091] In order to cause a large temperature difference between the laser chips, preferably, according to the arrangement order of the N heat sinks, the thermal conductivity of the N heat sinks increases linearly or decreases linearly.
[0092] Figure 5a Illustratively shows a schematic front view structure of another laser provided by an embodiment of the p...
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