Single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and preparing method thereof

Abstract

The invention discloses a single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and a preparing method thereof. A copper surface of the enhanced boiling heat transfer copper surface structure is of a single-layer surface structure composed of micron large holes and hole walls with nano hole gaps. The single-layer multi-scale micro-nano enhanced boiling heat transfer surface has the lower wall face overheat degree when boiling begins and in the boiling process. In addition, the simple low-cost large-scale preparing method for preparing the single-layer micro-nano double-scale enhanced boiling heat transfer copper surface is suitable for modifying shapes of various boiling substrate surfaces, expensive mechanical devices are not needed, and the surface saves energy, is environment-friendly, is short in generation period and has the good industrial application prospect.

Description

technical field [0001] The invention belongs to the field of material science, and in particular relates to a single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and a preparation method thereof. Background technique [0002] Enhanced boiling heat transfer has the characteristics of low temperature difference and high heat flux density, and is one of the effective ways to solve the heat dissipation problem of small volume and high power microelectronics. Porous materials, such as sintered metal porous structures (CN 105180709 A), etc., are commonly used to increase the critical heat flux (CHF) of the boiling surface. But it is usually accompanied by the problem of excessive wall superheat at the initial stage of boiling, that is, when the heat flux is low. In recent years, with the development of technology, more and more attention has been paid to multi-scale boiling surfaces. Through the control of multi-scale sizes, the separation...

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Problems solved by technology

[0004] Aiming at the problem that the superheat of the wall surface is too high at the initial boiling of the porous structure prepared by the traditional hydrogen template method, the purpose of the present invention is to provide a single-layer micro-nano dual-scale enhanced boiling heat transfer copper surface structure, which can make the boiling Initially there is a low wall superheat and a high critical heat flux

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