Single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and preparing method thereof

A technology to strengthen boiling and surface structure, applied in the field of material science, can solve the problems of low wall superheat and high wall superheat, and achieve the effect of low wall superheat, short generation cycle and good industrial application prospects.

Inactive Publication Date: 2017-02-15
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the problem that the superheat of the wall surface is too high at the initial boiling of the porous structure prepared by the traditional hydrogen template method, the purpose of the present inv

Method used

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  • Single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and preparing method thereof
  • Single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and preparing method thereof

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Experimental program
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Effect test

Embodiment 1

[0027] (1) Surface pretreatment: Use dilute sulfuric acid solution, hot alkali solution, and deionized water to clean the surface oxide and oil stains on the copper substrate.

[0028] (2) Surface deposition: the copper substrate is used as the cathode, and the copper sheet is used as the anode, and put into the electrolyte solution with a solution ratio of 1.0M sulfuric acid and 0.4M copper sulfate. Through direct current, keep the cathode current density at 1A / cm 2 , The electrodeposition reaction time is 30s.

[0029] (3) Sample sintering: Under the protection of reducing atmosphere, heat treatment is carried out at a sintering temperature of 710°C to enhance the mechanical strength of the product, thereby obtaining samples.

[0030] Such as figure 1 As shown, the copper surface is a single-layer surface structure composed of micron macropores and pore walls with nanopores. The pore size of the micron macropores is substantially the same at the bottom and the top. The p...

Embodiment 2

[0032] (1) Surface pretreatment: Use dilute sulfuric acid solution, hot alkali solution, and deionized water to clean the surface oxide and oil stains on the copper substrate.

[0033] (2) Surface deposition: the copper substrate is used as the cathode, and the copper sheet is used as the anode, and put into the electrolyte solution with a solution ratio of 1.5M sulfuric acid and 0.1M copper sulfate. Through direct current, keep the cathode current density at 0.5A / cm 2 , The electrodeposition reaction time is 200s.

[0034] (3) Sample sintering: Under the protection of reducing atmosphere, heat treatment is carried out, and the sintering temperature is 410°C to enhance the mechanical strength of the product, so as to obtain samples, electron microscope images and figure 1 Basically the same.

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Abstract

The invention discloses a single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and a preparing method thereof. A copper surface of the enhanced boiling heat transfer copper surface structure is of a single-layer surface structure composed of micron large holes and hole walls with nano hole gaps. The single-layer multi-scale micro-nano enhanced boiling heat transfer surface has the lower wall face overheat degree when boiling begins and in the boiling process. In addition, the simple low-cost large-scale preparing method for preparing the single-layer micro-nano double-scale enhanced boiling heat transfer copper surface is suitable for modifying shapes of various boiling substrate surfaces, expensive mechanical devices are not needed, and the surface saves energy, is environment-friendly, is short in generation period and has the good industrial application prospect.

Description

technical field [0001] The invention belongs to the field of material science, and in particular relates to a single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and a preparation method thereof. Background technique [0002] Enhanced boiling heat transfer has the characteristics of low temperature difference and high heat flux density, and is one of the effective ways to solve the heat dissipation problem of small volume and high power microelectronics. Porous materials, such as sintered metal porous structures (CN 105180709 A), etc., are commonly used to increase the critical heat flux (CHF) of the boiling surface. But it is usually accompanied by the problem of excessive wall superheat at the initial stage of boiling, that is, when the heat flux is low. In recent years, with the development of technology, more and more attention has been paid to multi-scale boiling surfaces. Through the control of multi-scale sizes, the separation...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/50C25D5/34
CPCC25D3/38C25D5/34C25D5/50
Inventor 莫冬传汪亚桥吕树申
Owner SUN YAT SEN UNIV
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