Compound fault diagnosis method for clamping diodes and supporting capacitors of inverter

A technology of clamping diodes and compound faults, which is applied in the fields of instruments, measuring electricity, measuring electrical variables, etc., can solve the problems that the compound fault diagnosis method is rarely raised, and achieve the effect of real-time diagnosis, fast optimization speed, and easy characterization.

Inactive Publication Date: 2017-02-15
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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Problems solved by technology

There are 12 IGBT power transistors, 6 clamping diodes and 2 DC support capacitors in the three-level inverter. IGBT fault diagnosis methods have been proposed in many literatures. However, the

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  • Compound fault diagnosis method for clamping diodes and supporting capacitors of inverter
  • Compound fault diagnosis method for clamping diodes and supporting capacitors of inverter
  • Compound fault diagnosis method for clamping diodes and supporting capacitors of inverter

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Embodiment Construction

[0043] Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail:

[0044] The method of the present invention provides a three-level inverter circuit, such as figure 1 As shown, the specific structure is: it includes a three-phase bridge arm circuit and two DC voltage sources, wherein each phase bridge arm includes four power transistor IGBTs connected in series and two clamping diodes connected in parallel at both ends of the IGBT, and the clamping diode consists of From top to bottom, from left to right, they are labeled D1, D2, D3, D4, D5, D6. The DC voltage source includes two DC support capacitors, labeled C1 and C2.

[0045] The present invention is achieved through the following methods and steps:

[0046] The first step is to measure the voltage across the DC support capacitor of the inverter under no fault conditions, such as figure 2 As shown, it can be seen that the voltage across the supporting capac...

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Abstract

The invention discloses a compound fault diagnosis method for clamping diodes and supporting capacitors of an inverter. The method comprises the following steps: establishing a three-level inverter compound fault model through simulation software; respectively acquiring three-phase current signals on an output side of the inverter under the normal working conditions and under the condition of each compound fault, carrying out decomposition of three-phase currents under each condition through EMD, and constructing fault feature vectors by using correlation coefficients as fault features; carrying out normalization processing of the fault feature vectors, inputting each normalized feature vector as a training sample into an SVM classifier for training, and optimizing SVM parameters through the genetic algorithm, so as to obtain trained SVM classifiers; and acquiring inverter fault signals to be diagnosed during a testing phase, constructing the fault feature vectors through the same method, inputting the fault feature vectors into the trained SVM classifiers for testing, and outputting fault diagnosis results.

Description

technical field [0001] The invention relates to a composite fault diagnosis method for inverter clamping diodes and supporting capacitors, belonging to the field of fault diagnosis of power electronic devices. Background technique [0002] The multi-level converter is a new type of converter that realizes high-voltage and high-power output by changing the topology of the converter itself. It does not need a buck-boost circuit and a voltage-balancing circuit. Compared with two-level inverters, multi-level inverters have the advantages of low power switch voltage stress, power device series voltage equalization, low harmonic content of output voltage waveform, small electromagnetic interference problems, small switching losses and high work efficiency. Therefore, inverters with this structure are widely used in high-voltage, high-current, and high-power fields, such as Japan's 700-series Shinkansen, Shanghai Maglev trains, and Harmony CRH trains. The most typical of the multi...

Claims

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Application Information

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IPC IPC(8): G06F17/50G01R31/00
CPCG01R31/00G06F30/20
Inventor 陈复扬金林强
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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