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Novel sulfonyl imide salt compound, production method for same, and photoacid generator and light-sensitive resin composition comprising same

A technology of sulfonylimide salt compound and photosensitive resin, which is applied in the direction of nitrogen compounds, chemical instruments and methods, nitrogen and non-metallic compounds, etc., and can solve problems such as high sensitivity that cannot be solved

Inactive Publication Date: 2017-02-15
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Korean Laid-Open Patent No. 2008-0046560 describes a photosensitive resin composition that additionally contains an adhesion enhancer, but it cannot solve the problem of high sensitivity

Method used

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  • Novel sulfonyl imide salt compound, production method for same, and photoacid generator and light-sensitive resin composition comprising same
  • Novel sulfonyl imide salt compound, production method for same, and photoacid generator and light-sensitive resin composition comprising same
  • Novel sulfonyl imide salt compound, production method for same, and photoacid generator and light-sensitive resin composition comprising same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0208] Synthesis Example 1: Synthesis of Photoacid Generator

[0209] 1-1: Synthesis of photoacid generator a-1

[0210] [Reaction 1]

[0211]

[0212] Triphenylsulfonium bromide (manufactured by TCI Co., Ltd., 34.3 g, 0.1 mol) was dissolved in 200 mL of distilled water, and fluorosulfonimide potassium salt (manufactured by Mitsubishi Chemical Corporation, 32.9 g, 0.15 mol) dissolved in 100 g of distilled water was added. ) solution, stirred at room temperature for 2 hours. After that, extraction was performed using toluene (200 mL), and the toluene layer was evaporated under reduced pressure to remove the solvent to obtain a-1 (44.0 g). This was analyzed with an elemental analyzer (manufactured by Thermo Electron Scientific Instrument, Flash EA1112), and confirmed to be a-1.

[0213] Elemental analysis data: C, 48.71; H, 3.43; N, 3.12; O, 14.49; S, 21.67

[0214] 1-2: Synthesis of photoacid generator a-2

[0215] [Reaction 2]

[0216]

[0217] Diphenyl iodine ...

experiment example

[0224] (1) Evaluation test of curing rate (reaction rate)

[0225] Using a wire bar, apply the photosensitive resin composition obtained in the foregoing Examples and Comparative Examples to a thickness of 10 μm on glass, and expose it to 100 mJ / cm2 using a high-pressure mercury lamp. 2 light, heat at 80 °C for 10 min. Afterwards, remove a part of the cured film and dissolve it in CDCl 3 The solvent was analyzed by NMR analysis to analyze the content of residual epoxy groups, and the reaction rate was calculated and shown in Table 2.

[0226] Reaction rate = (epoxy content before exposure - epoxy content after exposure) / epoxy content before exposure × 100

[0227] The epoxy content before and after the exposure was calculated and confirmed from the integral of epoxy on the spectrum with respect to the NMR integration of the phenyl group in the molecule.

[0228] (2) Evaluation of color tone after curing

[0229] The color tone of the pattern produced in Experimental ...

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Abstract

The present invention relates to a novel sulfonyl imide salt compound, and to a photoacid generator and a photoacid resin composition comprising same, and more specifically relates to a light-sensitive resin composition which exhibits outstanding light sensitivity and of which the curing rate can be markedly improved, by including a sulfonyl imide salt compound represented by chemical formula 1.

Description

technical field [0001] The present invention relates to a novel sulfonylimide salt compound and a photosensitive resin composition containing the same. Background technique [0002] Photosensitive resin is a representative functional polymer material that is practically used in the production of various precision electronic and information industry products. Currently, it is used in the production of high-tech industries, especially semiconductors and displays. In general, photosensitive resin refers to a polymer compound that causes chemical changes in molecular structure in a short period of time by light irradiation, resulting in changes in physical properties such as solubility in specific solvents, coloring, and curing. When photosensitive resin is used, micro-precision processing can be performed, energy and raw materials can be greatly reduced compared with thermal reaction processes, and operations can be performed quickly and accurately with a small installation spa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B21/088C01B21/086G03F7/004
CPCG03F7/0045G03F7/0046C01B21/093
Inventor 崔汉永
Owner DONGWOO FINE CHEM CO LTD
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