Wafer level packaging based MEMS wind speed and wind direction sensor structure and packaging method
A wafer-level packaging, wind speed and direction technology, used in instruments, measurement devices, and the use of thermal variables to measure fluid velocity, etc., can solve problems such as affecting sensor performance, affecting sensor sensitivity and response time, and reducing power consumption and cost. Effect
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[0039] The present invention will be further described below in conjunction with the drawings and specific embodiments.
[0040] Such as Figure 1-6 As shown, a MEMS wind speed and direction sensor structure based on wafer-level packaging includes a silicon chip 110 and a ceramic chip;
[0041] The silicon chip 110 includes a silicon wafer 20 and a silicon dioxide heat-insulating layer 10. The silicon dioxide heat-insulating layer 10 is arranged on the silicon wafer 20. The silicon dioxide heat-insulating layer 10 is provided with a heating element 26 for generating heat and a center The temperature measuring element 28 and the thermal sensing temperature measuring element 24, a central temperature measuring element 28 is set in the center of the square silicon chip 110, the four heating elements 26 and the four thermal sensing temperature measuring elements 24 are all centered on the temperature measuring element 28 The heating element 26 and the thermal sensing temperature measu...
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