Additives for high-purity copper electrolytic refining, method for producing high-purity copper, and high-purity electrolytic copper

A copper electrolytic refining, high-purity technology, applied in the direction of instruments, optics, photography, etc., can solve the problems of chlorine and silver shortage

Active Publication Date: 2020-02-07
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The object of the present invention is to provide an additive for electrolytic refining of high-purity copper including a silver chloride reducing agent for electrolytic refining of copper, which solves the above-mentioned problems in the prior art and can easily produce high-purity copper with less chlorine and silver, and an additive using the additive. Manufacturing method of high-purity copper

Method used

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  • Additives for high-purity copper electrolytic refining, method for producing high-purity copper, and high-purity electrolytic copper
  • Additives for high-purity copper electrolytic refining, method for producing high-purity copper, and high-purity electrolytic copper
  • Additives for high-purity copper electrolytic refining, method for producing high-purity copper, and high-purity electrolytic copper

Examples

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Embodiment 1

[0051] Using the silver chloride reducing agent (A, B, C) constituting the additive of the present embodiment, an aqueous copper sulfate solution and an aqueous copper nitrate solution adjusted to an acid concentration of 50 g / L, a copper concentration of 50 g / L, and a chloride ion concentration of 100 mg / L were used. Or a copper pyrophosphate aqueous solution is used as a copper electrolytic solution, and the above-mentioned silver chloride reducing agent is added in the mode of the concentration shown in Table 1 in this copper electrolytic solution. In addition, electrolytic copper having a sulfur concentration of 5 mass ppm and a silver concentration of 8 mass ppm was used for the anode, and a SUS316 plate was used as the cathode substrate. Set the current density to 200A / m 2 , copper electrolysis was carried out at a bath temperature of 30° C. for 5 days, and the concentration of the silver chloride reducing agent was measured by HPLC (high performance liquid chromatograph...

Embodiment 2

[0061]As shown in Table 2, together with the silver chloride reducing agent (A, B, C) of Example 1 and other silver chloride reducing agents D (5-phenyl-1H-tetrazole), the impurity reducing agent (F, G , H, I, J, K) are added to the copper electrolyte, and in addition, a part of the impurity reducing agent and / or stress relaxation agent (L, M, N, O) is used together with the silver chloride reducing agent. The added concentration of the silver chloride reducing agent was 10 mg / L, the added concentration of the impurity reducing agent was set to 10 mg / L, 100 mg / L, and when the stress relaxing agent was used, the concentration of the stress relaxing agent was set to 10 mg / L. Acid concentration in copper electrolytic solution, copper concentration, chloride concentration, and other electrolytic conditions Copper electrolytic refining was performed under the same conditions as in Example 1 to produce electrolytic copper. Impurity reducing agents (F to K) and stress relaxants (L to...

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Abstract

The present invention provides an additive for high-purity copper electrolytic refining, a method of producing high-purity copper, and a high-purity electrolytic copper. This additive of the present invention for high-purity copper electrolytic refining can be added to a copper electrolyte in copper electrolytic refining. The additive includes a silver and chlorine reducing agent of electrolytic copper which is formed of tetrazoles which is one of a tetrazole and a tetrazole derivative.

Description

technical field [0001] The present invention relates to an additive for electrolytic refining of high-purity copper for producing high-purity copper with less chlorine and silver, a method for producing high-purity copper, and high-purity electrolytic copper. [0002] This application is for Japanese patent application No. 2015-194834 filed on September 30, 2015, Japanese patent application No. 2016-107269 filed on May 30, 2016, and Japanese patent application filed on August 20, 2016 No. 2016-161591 claims priority, and its contents are incorporated herein. Background technique [0003] As a method for producing high-purity copper, as described in Japanese Patent Publication No. 08-990, there is known a method of performing electrolysis in two steps: after electrolyzing an aqueous solution of copper sulfate, the copper deposited on the cathode is used as an anode , further in copper nitrate aqueous solution at 100A / m 2 The following low current densities were used for re-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25C1/12
CPCC25C1/12
Inventor 樽谷圭荣久保田贤治中矢清隆
Owner MITSUBISHI MATERIALS CORP
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