Diamond scribing knife for light filter glass cutting, and preparation method thereof

Abstract

The invention discloses a diamond scribing knife for light filter glass cutting. The diamond scribing knife is composed of a metal-based matrix and diamond abrasives, and is characterized in that the content in percentage by volume of diamond in the scribing knife is 25-55%, and the particle size is 10-30[mu]m; the metal-based matrix comprises, by mass, 45-59% of copper powder, 25-35% of tin powder, 5-15% of nickel powder, 5-10% of silver powder, 5-15% of zinc powder and 1-10% of graphite. The cutting edge of the scribing knife has a great cutting morphology; the scribing knife has the characteristics of being high in holding force, high in exposure degree, long in life and the like on the premise of meeting the machining quality, has a speed of 12mm / s during test use, and is stable in quality and free from the phenomena of knife breakage and spark in the case of being used in batches. The invention provides a preparation method for the scribing knife simultaneously. The method is more suitable for mixing preparation for raw materials with small particle sizes, beneficial to more uniform formation of blade structures, and also beneficial to stable control for the batch-to-batch quality of blades.

Description

technical field [0001] The invention relates to a diamond scribing knife for cutting filter glass and a preparation method thereof. Background technique [0002] Wafer Level Chip Scale Packaging (WLCSP for short), that is, wafer-level chip packaging, is different from the traditional chip packaging (cutting first, then packaging and testing, and at least 20% of the original chip is added after packaging). Volume), this latest technology is to package and test on the whole wafer first, and then cut into IC particles one by one, so the volume after packaging is equal to the original size of IC die. The WLCSP packaging method not only significantly reduces the size of the memory module, but also meets the high-density requirements of mobile devices for the body space; on the other hand, in terms of performance, it improves the speed and stability of data transmission. [0003] The diameters of packaged products are mainly 3inch, 6inch, 8inch. Wafer products with a diameter of ...

AI Technical Summary

Problems solved by technology

However, due to the flake shape of graphite, it is not easy to be uniformly dispersed and easily agglomerated, resulting in poor uniformity of the blade structure, and there is a risk of block shedding and fracture during cutting. In addition, graphite itself has no grinding ability and cannot improve the grinding performance of fine-grained diamond blades. Therefore, Not suitable for use in existing filter glass metal matrix cutting blades