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Fluxgate sensor chip

A fluxgate sensor and chip technology, applied in instruments, measuring magnetic variables, measuring devices, etc., can solve the problems of difficulty in reducing the size of the fluxgate sensor, sensor damage, etc., to avoid chemical mechanical polishing process, reduce noise and energy consumption, the effect of improving signal response speed

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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the need to punch through holes in the manufacturing process to realize the winding of the coil on the magnetic core, the sensor may be damaged in the process of passing through
Also, it is difficult to reduce the size of the fluxgate sensor according to this method compared to MEMS technology

Method used

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Embodiment Construction

[0030] The idea, specific structure and technical effects of the present invention will be further described below in conjunction with the accompanying drawings, so as to fully understand the purpose, features and effects of the present invention.

[0031] like Figure 1-3 As shown, the fluxgate sensor chip using silicon dioxide film insulation coating of the present invention includes a high-resistance silicon substrate 1, an excitation coil 2, a detection coil 3, a magnetic core 4, electrodes 5 and a silicon dioxide film 6, wherein Both the excitation coil and the detection coil are micro-electromechanical three-dimensional solenoid coils, the bottom coils of the excitation coil and the detection coil are located in the silicon microgroove array 7 on the surface of the high-resistance silicon substrate, and the upper surface of the bottom coil is flush with the surface of the silicon substrate. The wire width and gap of the bottom coil and the top coil of the excitation coil...

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Abstract

The invention discloses a fluxgate sensor chip, and relates to the field of MEMS integration micro manufacturing. The fluxgate sensor chip comprises a high-sensitivity silicon substrate, an excitation coil, a detection coil, a magnetic core, electrodes and silicon oxide films, wherein both the excitation coil and the detection coil are micro electro-mechanical three-dimensional solenoid coils, bottom coils of the excitation coil and the detection coil are located in a silicon microgroove array at the surface of the high-sensitivity silicon substrate, the upper surfaces of the bottom coils are flush with the surface of the silicon substrate, and the bottom coils are insulated from the silicon substrate and the magnetic core through the silicon dioxide films; and the bottom coils, the magnetic core and top coils are insulated from each other through the silicon dioxide films. The fluxgate sensor chip adopts the silicon dioxide films to perform insulation coating, so that the mechanical strength of the integrated fluxgate sensor chip is improved. In addition, the fluxgate sensor chip is completely compatible with a microelectronic process, and compatible and synchronous integrated manufacturing of the integrated fluxgate sensor chip and a CMOS interface circuit can be realized.

Description

technical field [0001] The invention relates to the field of MEMS integrated micro-manufacturing, in particular to a fluxgate sensor chip manufactured using MEMS technology and coated with silicon dioxide film insulation, which is used for measuring weak magnetic fields. Background technique [0002] As a traditional weak magnetic field detection device, the fluxgate sensor has always had its unique advantages and cannot be replaced by other magnetic field sensors. In recent years, it has continuously discovered its application potential in new fields, such as GPS positioning of small mobile devices, Missile inertial guidance, small satellite azimuth and attitude control, motion detection in virtual reality space, geomagnetic compensation and point noise compensation for high-definition television (HDTV), etc. In recent years, due to the gradual expansion of applications in various occasions, the requirements for devices tend to be thinner, lighter, and cheaper. Correspondi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R33/05
CPCG01R33/05
Inventor 雷冲周勇
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