A kind of nano-silver/epoxy resin composite thermal interface material and preparation method thereof

A technology of thermal interface material and epoxy resin, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve problems affecting the performance of electronic products, uneven dispersion, inconsistent material properties, etc., to improve the interface heat transfer efficiency, The preparation method is simple and the effect of reducing the interface thermal resistance

Inactive Publication Date: 2019-04-26
WUHAN UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Usually, the method of preparing nano-silver / epoxy resin composite thermal interface materials is the direct mixing method, that is, the nano-silver particles are directly mixed with the polymer matrix. Using this method, nano-silver is often dispersed unevenly in the epoxy resin, and the material properties are inconsistent. , affecting the performance of the final prepared electronic product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Preparation of nano-silver / epoxy resin composite thermal interface material, the steps are as follows:

[0021] 1) Add 7.5 g of silver acetate to 0.625 g of complexing agent N-(2-aminoethyl)-3-aminopropyltriethoxysilane, mix uniformly to obtain a silver complex, and then combine the obtained silver complex , 1.35 grams of reducing agent o-phthalaldehyde and 0.25 grams of curing agent 2-ethyl-4-methylimidazole were added to 2.5 grams of E51 epoxy resin in sequence, and stirred to obtain a mixed sol;

[0022] 2) Pour the mixed sol obtained in step 1) into a mold, place it in a heating box, heat at a constant temperature of 70°C for 2 hours, and then heat to 130°C for 2 hours to obtain a nano-silver / epoxy composite thermal interface material.

[0023] According to the transient planar heat source method, using the HotDisk TPS-2500S thermal constant analyzer, the thermal conductivity of the thermal interface material obtained in this embodiment is measured to be 3.25 W / mK.

Embodiment 2

[0025] Preparation of nano-silver / epoxy resin composite thermal interface material, the steps are as follows:

[0026] 1) Add 2.5 g of silver nitrate to 0.25 g of complexing agent ethylene diamine, mix uniformly to obtain a silver complex, and then combine the obtained silver complex, 0.45 g of reducing agent isophthalaldehyde and 0.125 g of curing agent 2-ethyl 4-methylimidazole was sequentially added to 2.5 g of E44 epoxy resin, and stirred to obtain a mixed sol;

[0027] 2) Pour the mixed sol obtained in step 1) into a mold, place it in a heating box, heat at a constant temperature of 50°C for 6 hours, and then heat up to 90°C for 6 hours to obtain a nano silver / epoxy resin composite thermal interface material.

[0028] According to the transient plane heat source method, using the HotDisk TPS-2500S thermal constant analyzer, the thermal conductivity of the thermal interface material obtained in this embodiment is measured to be 0.53 W / mK.

Embodiment 3

[0030] Preparation of nano-silver / epoxy resin composite thermal interface material, the steps are as follows:

[0031] 1) Add 5 g of silver carbonate to 0.5 g of complexing agent γ-aminopropyltriethoxysilane, mix uniformly to obtain a silver complex, and then combine the obtained silver complex, 0.8 g of reducing agent isophthalaldehyde and 0.25 g of curing agent 2-ethyl-4-methylimidazole was added to 2.5 g of E44 epoxy resin in sequence, and stirred to obtain a mixed sol;

[0032] 2) Pour the mixed sol obtained in step 1) into a mold, place it in a heating box, heat at a constant temperature of 60°C for 4 hours, and then heat up to 110°C for 4 hours to obtain a nano-silver / epoxy composite thermal interface material.

[0033] According to the transient planar heat source method, using the HotDisk TPS-2500S thermal constant analyzer, the thermal conductivity of the thermal interface material obtained in this embodiment is measured to be 1.21 W / mK.

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Abstract

The invention relates to a nanosilver / epoxy resin composite thermal interface material and a preparation method thereof. The nanosilver / epoxy resin composite thermal interface material is prepared through the following method: (1) adding silver salt to a complexing agent, and performing uniform mixing so as to obtain a silver complex; and sequentially adding the silver complex, a reducing agent containing two aldehyde groups and an imidazole curing agent to epoxy resins, and performing uniform mixing so as to obtain mixed sol; and (2) pouring the mixed sol obtained in the step (1) to a mold, placing the mold in a heating box, performing heating under the constant temperature of 50-70 DEG C for 2-6h, then performing temperature rise to 90-130 DEG C, performing heating under constant temperature for 2-6h, so as to obtain the nanosilver / epoxy resin composite thermal interface material. According to the nanosilver / epoxy resin composite thermal interface material provided by the invention, the heat conductivity can reach 3.25W / mK, the interface heat-transfer efficiency is greatly improved, interface thermal resistance is effectively reduced, few defects exist and the properties are favorable.

Description

Technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a nano-silver / epoxy resin composite thermal interface material and a preparation method thereof. Background technique [0002] With the development of electronic devices in the direction of miniaturization and miniaturization, and the increasing integration of electronic chips, the working efficiency and reliability of electronic devices are increasingly dependent on the solution of heat dissipation problems, so the heat dissipation of electronic packaging has become more and more Important. In order to reduce the contact thermal resistance of two contact surfaces in an electronic package, a thermal interface material with high thermal conductivity is generally added between the contact surfaces. Nowadays, polymer thermal interface materials filled with high thermal conductivity nanoparticles are a hot spot in the field of thermal interface materials. Among them, high ther...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/08C09K5/14
CPCC08K3/08C08K2003/0806C08K2201/011C09K5/14C08L63/00
Inventor 晏石林鲍睿邵世东王若谷
Owner WUHAN UNIV OF TECH
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