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Wafer defect detection method based on characteristic matching

A feature matching and defect detection technology, applied in image data processing, instrument, character and pattern recognition, etc., can solve the problems of low detection efficiency and poor detection effect, achieve high detection efficiency, reduce dimensionality, and meet real-time requirements Effect

Inactive Publication Date: 2017-04-26
SOUTH CHINA UNIV OF TECH
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  • Abstract
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Problems solved by technology

However, in the prior art, wafer defects are generally detected by visual inspection, which not only has poor detection effect but also low detection efficiency.

Method used

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  • Wafer defect detection method based on characteristic matching
  • Wafer defect detection method based on characteristic matching
  • Wafer defect detection method based on characteristic matching

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Embodiment Construction

[0068] The technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0069] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0070] Overall, such as...

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Abstract

The invention discloses a wafer defect detection method based on characteristic matching and relates to the image processing method technology field. The method comprises the following steps of collecting a wafer sample image, matching the wafer sample image with a chip template image and searching a single chip area to be detected in the wafer sample image; describing characteristic vectors of characteristic points of the chip template image and a chip image to be detected; matching the characteristic points of the chip template image and the chip image to be detected, rejecting a mismatching point, and according to a matched result, completing position adjusting and correction of the chip image to be detected; and carrying out binarization on the chip template image and the registered chip image to be detected so as to realize extraction of chip defect information. By using the method, small defects on a wafer can be effectively detected, detection efficiency is high and detection stability is good.

Description

technical field [0001] The invention relates to the technical field of image processing methods, in particular to a method for detecting wafer defects based on feature matching. Background technique [0002] With the rapid development of integrated circuit manufacturing technology, the feature size of wafers is continuously reduced, resulting in more tiny defects. Defects on the wafer surface have become a major obstacle affecting yield. Therefore, the study of defects is becoming more and more important, and the research results of defects can be used to improve or improve the process, thereby increasing the yield of products, and at the same time improving the reliability of IC chips. However, in the prior art, wafer defects are generally detected by visual inspection, which not only has poor detection effect but also low detection efficiency. Contents of the invention [0003] The technical problem to be solved by the present invention is how to provide a feature-matc...

Claims

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Application Information

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IPC IPC(8): G06T7/00G06T7/10G06T7/136G06K9/46
CPCG06T7/0004G06T2207/30141G06T2207/10004G06V10/462
Inventor 杜娟谭健胜胡跃明
Owner SOUTH CHINA UNIV OF TECH
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