Sintering method of high-temperature co-firing aluminum nitride ceramics

A technology of aluminum nitride ceramics and sintering method, which is applied in the field of multi-chip components (MCM) and high-power ceramic substrates and shells, and can solve the problems of ceramic sintering quality decline, ceramic strength and metallization strength influence, and volatility, etc. Achieve metallization strength, avoid excessive volatilization, and meet flexural strength

Inactive Publication Date: 2017-05-10
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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Problems solved by technology

However, the second phase formed by the sintering aid during sintering is easy to volatilize at high temperature, which has a great i...

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  • Sintering method of high-temperature co-firing aluminum nitride ceramics
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  • Sintering method of high-temperature co-firing aluminum nitride ceramics

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Embodiment 1

[0031] A sintering method for preparing high-temperature co-fired aluminum nitride ceramics, the method is as follows:

[0032] 1) According to the weight ratio of 80% AlN powder, 4% sintering aid (yttrium oxide, calcium oxide), 7% binder, 4% plasticizer, 5% solvent (acetone) to prepare the green porcelain slurry, through casting Process to produce AlN green ceramic parts; the surface of AlN green ceramic sheets is printed with tungsten metallization paste by printing process;

[0033] 2) A number of AlN raw porcelain pieces are laminated and hot-pressed to form a multi-layer green porcelain piece, and at the same time, some AlN green porcelain pieces are made of flexural strength and thermal conductivity through lamination, hot pressing, raw cutting or laser cutting processes Green porcelain standard samples for testing;

[0034] 3) Put the raw porcelain parts and raw porcelain standard samples on the AlN or tungsten firing plate, and put them in the debinding furnace for de...

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Abstract

The invention provides a sintering method of high-temperature co-firing aluminum nitride ceramics. The method comprises the following steps (1) manufacturing an aluminum nitride raw ceramic piece by using aluminum nitride raw ceramics and metal slurry according to a multilayer ceramic production process; (2) performing glue discharging on the aluminum nitride production ceramic piece in a glue discharging furnace; (3) putting the raw ceramic element subjected to glue discharging into a duplex sealing firing device; (4) putting the firing device containing the aluminum nitride production ceramic piece into a high-temperature atmosphere sintering furnace to be sintered. The method provided by the invention has the advantages that (1) the method can be used for preparing high-temperature co-firing aluminum nitride ceramics, and is applied to the fields of MCM (multi-chip module) base plates and encapsulation, base plates of high-power devices, cases, high-power LED (light-emitting diode) encapsulation cases and the like; (2) by using the method for sintering, the excessive volatilization of the second phase in the aluminum nitride ceramics can be avoided; the heat conductivity, the folding-resistant intensity and the metallization intensity of the obtained co-firing aluminum nitride ceramics can meet the use requirements of electronic ceramics.

Description

technical field [0001] The invention relates to a high-temperature co-fired aluminum nitride (AlN) ceramics sintering method, which belongs to the technical field of electronic ceramics and is mainly used in the fields of multi-chip components (MCM) and high-power ceramic substrates and casings. Background technique [0002] High temperature co-fired ceramics (HTCC) can be divided into alumina and aluminum nitride according to the material system. The main advantages of aluminum nitride high-temperature co-fired ceramics are high thermal conductivity, high mechanical strength, good electrical properties, non-toxicity, and matching of thermal expansion coefficient with silicon. They are mainly used in MCM substrates and packages, substrates, casings, and High-power LED package shell and other fields. The sintering temperature of aluminum nitride ceramics is very high, generally between 1600 ° C and 2000 ° C, so the metal slurry co-fired with it must be resistant to high temp...

Claims

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Application Information

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IPC IPC(8): C04B35/581C04B35/64
CPCC04B35/581C04B35/64C04B2235/404C04B2235/6562C04B2235/6565C04B2235/6567C04B2235/6582C04B2235/66C04B2235/96C04B2235/9607
Inventor 夏庆水陈寰贝程凯庞学满张智旻
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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