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A kind of anti-ion migration filler and copper clad laminate

A technology of ion migration and molecular formula, which is applied in the field of ion migration-resistant materials, can solve the problems of loss of insulation, poor ion migration resistance, and easy conduction of plates, so as to improve moisture resistance, reduce drilling defects, and enhance durability. The effect of the ability to migrate ions

Active Publication Date: 2018-12-25
SUZHOU GINET NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reasons for the occurrence of CAF are: the pH of the system is too high or too low, resulting in the corrosion of the copper foil to form metal ions; or drilling defects, resulting in the residual plating solution in the defects corroding the copper foil during electroplating and generating metal ions ; or the formation of copper trees makes the board easy to be turned on; or the circuit board absorbs water and forms metal ions, which makes the board easy to be turned on and loses insulation
[0004] The current copper-clad laminates usually use quartz powder as the filler of the resin layer, which has poor ion migration resistance.

Method used

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  • A kind of anti-ion migration filler and copper clad laminate
  • A kind of anti-ion migration filler and copper clad laminate
  • A kind of anti-ion migration filler and copper clad laminate

Examples

Experimental program
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Effect test

Embodiment 1

[0038] The preparation method of embodiment 1, hydrophobic silane coupling agent is:

[0039] Step (1), with 3mol compound 1 3mol compound 2 React with 6mol copper at 100°C-350°C to form compound 3

[0040] Step (2), reacting 2 mol of compound 3 and 1 mol of hydrazine in the presence of 0.5 mol of tetraethylammonium chloride at 100°C to 200°C to generate compound 4

[0041] Step (3), reacting 3 mol of compound 4, 3 mol of dichloropropene and 3 mol of sodium hydroxide at 100°C to 200°C to generate compound 5

[0042] Step (4), with 3mol compound 5 and 3mol compound 6 In the presence of 1mol aluminum chloride, react at 100°C to 200°C to generate a hydrophobic silane coupling agent

[0043] The yield is 85%-90%.

Embodiment 2

[0044] Embodiment 2, the preparation of filler:

[0045] 61% SiO 2 , 28% B 2 o 3 , 10% Al 2 o 3 , 1% ZnO was calcined and melted at 1600°C for 10 hours, and then crushed to obtain fillers.

Embodiment 3

[0046] Embodiment 3, the preparation of filler:

[0047] 70% SiO 2 , 5% B 2 o 3 , 15% Al 2 o 3 , 10% ZnO was calcined and melted at 1650°C for 8 hours and then crushed to obtain fillers.

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Abstract

The invention relates to an ion-migration-resistant material which comprises a glass base, wherein the pH value of the glass base is 6-7, and the Mohs hardness is 4-5. The ion-migration-resistant material is prepared by carrying out surface modification on the glass base by a hydrophobic silane coupling agent, and is a powdery or granular filler. When being used in the copper clad plate, the ion-migration-resistant material can obviously enhance the ion migration resistance of the copper clad plate on the premise of ensuring the other properties of the copper clad plate.

Description

technical field [0001] The invention belongs to the field of copper-clad laminates, and in particular relates to an ion-migration-resistant material that can be used as a filler for copper-clad laminates. Background technique [0002] Copper-clad laminate is a plate-shaped material made of insulating paper, glass fiber cloth or other fiber materials impregnated with resin, one or both sides covered with copper foil, and hot-pressed. It is the basic material of PCB. [0003] Ion migration: CAF (Conductive Anodic Filament) refers to the phenomenon that when an electric field is added between the electrodes of the printed circuit board, metal ions move along the glass fiber yarn from one metal electrode to the other, and metals and compounds are precipitated. This phenomenon will lead to The insulation has deteriorated. The reasons for the occurrence of CAF are: the pH of the system is too high or too low, resulting in the corrosion of copper foil to form metal ions; or drilli...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K9/06C08K3/36B32B17/04B32B17/12B32B37/06B32B37/10
CPCB32B5/02B32B5/26B32B37/06B32B37/1018B32B2260/023B32B2260/046B32B2262/101B32B2307/206B32B2457/08C08K3/36C08K9/06C08L2201/08C08L63/00
Inventor 贾波胡林政夏古俊
Owner SUZHOU GINET NEW MATERIAL TECH CO LTD
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