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A combination method of fluorine-containing resin prepreg for high-frequency copper-clad laminates

A technology of fluorine-containing resin and prepreg, which is applied in the field of communication materials, can solve the problems of high peel strength, high transmission loss, and high dielectric constant, and achieve the effects of high peel strength, high cross-linking density, and low dielectric constant

Active Publication Date: 2020-05-08
久耀电子科技(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a combination method of fluorine-containing resin prepreg for high-frequency copper-clad laminates, which solves the problem of high hygroscopicity, high dielectric constant, and high transmission loss of existing fluorine-containing resin copper-clad laminates when light and thin copper foils are used for lamination. The product has high peel strength and poor adhesion, and the problem of copper peeling is prone to occur

Method used

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  • A combination method of fluorine-containing resin prepreg for high-frequency copper-clad laminates
  • A combination method of fluorine-containing resin prepreg for high-frequency copper-clad laminates

Examples

Experimental program
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Effect test

Embodiment 1

[0031] The thickness of the copper foil used in this example is 13 μm, the number of prepregs used is 5, the models of the prepregs used are prepreg 2116 and prepreg 7628, the number of copper foils is 2, and the combination sequence is from top to The following are copper foil, 40 μm PTFE film, prepreg 2116, 35 μm PTFE film, prepreg 7628, prepreg 2116, prepreg 7628, 35 μm PTFE film, prepreg 2116, 40 μm PTFE film, and copper foil. The pressing temperature is 150°C and the pressure is 150kg / cm 2 , The pressing time is 52h.

[0032] The combination method of fluorine-containing resin prepregs for high-frequency copper-clad laminates in this embodiment includes the following steps:

[0033] A. Put the glass fiber cloth in an oven and bake at 430°C for 10 minutes to remove the paraffin wax on the surface;

[0034] B. Preparation of fluorine-containing resin impregnating solution: put polytetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer and water into...

Embodiment 2

[0040] The thickness of the copper foil used in this example is 13 μm, the number of prepregs used is 5, the models of the prepregs used are prepreg 2116 and prepreg 7628, the number of copper foils is 2, and the combination sequence is as follows To the bottom are copper foil, 70μm PTFE film, prepreg 2116, prepreg 7628, prepreg 2116, prepreg 7628, prepreg 2116, 70μm PTFE film, copper foil. The pressing temperature is 150°C and the pressure is 150kg / cm 2 , The pressing time is 52h.

[0041]The combination method of fluorine-containing resin prepregs for high-frequency copper-clad laminates in this embodiment includes the following steps:

[0042] A. Put the glass fiber cloth in an oven and bake at 420°C for 9.5 minutes to remove the surface paraffin;

[0043] B. Preparation of fluorine-containing resin impregnating solution: put tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer and tetrafluoroethylene-hexafluoropropylene copolymer with water in a stirrer, and stir for...

Embodiment 3

[0049] The thickness of the copper foil used in this embodiment is 16 μm, the number of sheets of prepreg used is 5 sheets, the number of sheets of copper foil is 2 sheets, the model of the prepreg used is prepreg 106, prepreg 7628, the number of sheets of copper foil It is 2 sheets, and the combination sequence from top to bottom is copper foil, 35 μm PTFE film, prepreg 106, 40 μm PTFE film, prepreg 7628, prepreg 106, prepreg 7628, 40 μm PTFE film, prepreg 2116, 35 μm PTFE film, and copper foil. The pressing temperature is 430°C, the pressure is 100kg / cm2, and the pressing time is 24h.

[0050] The combination method of fluorine-containing resin prepregs for high-frequency copper-clad laminates in this embodiment includes the following steps:

[0051] A. Put the glass fiber cloth in an oven and bake at 410°C for 9 minutes to remove the surface paraffin;

[0052] B. Preparation of fluorine-containing resin impregnation solution: put the fluorine-containing resin tetrafluoroet...

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Abstract

The invention discloses a high-frequency copper-clad plate and fluorine-containing resin prepreg combination mode. The high-frequency copper-clad plate and fluorine-containing resin prepreg combination mode comprises the steps of baking of glass fiber cloth, preparing of fluorine-containing resin impregnation liquid, dipping of the glass fiber cloth into the fluorine-containing resin impregnationliquid, plasma activation, pressing and the like, the problems that when light and thin copper foil is adopted for pressing, a copper-clad plate manufactured through an existing fluorine-containing resin copper-clad plate manufacturing technology is high in hygroscopicity, high in dielectric constant and high in transmission loss, a product is high in peel strength and poor in adhesiveness, and the phenomenon of falling off of a copper sheet is prone to being caused are solved, meanwhile, after being pressed, prepreg and the copper foil enter protective liquid to be impregnated, and the adhesion degree between the prepreg and the copper foil is enhanced again; and a protective liquid system is reasonable in component, compatibility among all the components is good, an interpenetrating network is formed advantageously under the cooperation action of various molecules, the use strength of the copper-clad plate is ensured, the structure is simple, and the water absorption rate is low.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a combination method of fluorine-containing resin prepregs for high-frequency copper-clad laminates. Background technique [0002] Nowadays, the information electronics industry is in a stage of rapid development and is gradually becoming one of the pillar industries of various countries. As one of the key materials in the information electronics industry, copper clad laminates are widely used in communication base stations, satellites, vending machines, computers, mobile phones, wearable devices, driverless cars, drones, intelligent robots and other fields. [0003] The substrate material will be the main key to the high frequency of circuit signal transmission, especially the copper clad substrate material technology. The DK and Df of the existing copper clad laminate are relatively high. Even if the circuit design is improved, it cannot fully meet all high fr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/00B32B37/10B32B38/16
Inventor 詹浩赵莉民
Owner 久耀电子科技(江苏)有限公司
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