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A kind of soluble polyimide-based resin polymer material and its application

A polymer material and polyimide-based technology, which is applied in the field of polyimide-based resin polymer materials and their preparation, can solve the problems of difficult to make liquid adhesives, imide is difficult to dissolve, and the rigidity of the main chain is large. And other problems, to achieve the effect of excellent dielectric strength, good light transmittance, low dielectric properties

Active Publication Date: 2021-11-09
成都博斐特新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, generally speaking, the molecular structure of imide contains a large number of aromatic ring structures, the rigidity of the main chain is large, the amide groups between the chains are easy to form hydrogen bonds, the cohesive energy is high and the crystallization tendency is strong, making imide Amines are difficult to dissolve in commonly used organic solvents, making it difficult to make them into liquid adhesives

Method used

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  • A kind of soluble polyimide-based resin polymer material and its application
  • A kind of soluble polyimide-based resin polymer material and its application
  • A kind of soluble polyimide-based resin polymer material and its application

Examples

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preparation example Construction

[0055] When the molar percentage of formula III and IV is 0%, the preparation method provided by the invention comprises the following steps:

[0056] The polymerized monomers corresponding to formulas I and II are added to the reaction kettle in molar percentages and sequentially, and the reaction system is fed with an inert gas (nitrogen, helium or argon); turn on the mechanical stirring, and react at 25°C for 30min~ 3h, and then the temperature of the reactor was raised to 80-120°C at a rate of 1-20°C / min, and reacted for 1-3h; Raise the temperature of the reactor to 100-150°C at a heating rate of / min, discharge water, react for 0.5-5 hours, and complete the reaction; discharge the material, wash with ethanol, and dry to obtain a soluble polyimide resin.

[0057] When the molar percentages of formula III and IV are not all 0%, the preparation method provided by the invention comprises the following steps:

[0058] One or several mole percentages of the polymerized monomer...

Embodiment 1

[0070] Add 3,3',4,4'-biphenyltetracarboxylic dianhydride (294g), 4,4'-diaminodiphenyl ether (210g), N,N-dimethylacetamide (1633g) together In the reactor, the reaction system is fed with nitrogen. At 25°C, start the mechanical stirring reaction for 30min; then add N,N-dimethylacetamide (1633g) to the reaction kettle, and then add pyromellitic dianhydride (222g), isophoronediamine (161.5 g) Add it into the reaction kettle, and continue stirring for 30 minutes. Then the temperature of the reactor was raised to 100°C at a heating rate of 5°C / min, and reacted for 1h; then toluene (250g) was added to the reactor, and the temperature was raised to 150°C at a heating rate of 5°C / min, and water began to flow out. After reacting for 4h, the heating was stopped. The material is discharged, washed with ethanol, and dried to obtain a soluble polyimide resin.

Embodiment 2~5

[0072] The raw materials were weighed according to the types and dosages of monomers corresponding to Examples 2-5 in Table 3, and reacted under the conditions of Example 1 to obtain the polyimide resin of the present invention.

[0073] The monomer types in Table 3 are replaced by letters and numbers, and their meanings can be obtained from Tables 1 and 2. The letters represent the corresponding columns in Table 1 and Table 2, and the numbers represent the corresponding rows in Table 1 and Table 2. For example, implementation The A1 monomer in Example 1 refers to the monomer compound indicated in the first row of column A in Table 1.

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Abstract

The invention discloses a soluble polyimide-based resin polymer material and the application of the material. The resin polymer material is composed of 10-90% of formula I, 10-90% of formula II, 0-40% of formula III, and 0-40% of repeating units of formula IV. The polymer material has high solubility, high adhesiveness, high heat resistance, high dimensional stability, high insulation, high resistance to ion migration, high softness, high light transmittance, high dielectric strength, Bending buckling, low dielectric constant, low dielectric loss, low moisture absorption, controllable glass transition temperature and other excellent properties, not only can be used as adhesive materials and packaging materials in the fields of electronics, automobiles, rail transit and aerospace, It can also be used as a film material in the fields of flexible printed circuit boards, insulation protection, optics, packaging, sound insulation, etc., making up for the shortcomings of the prior art.

Description

technical field [0001] The invention belongs to the field of new materials, and in particular relates to a soluble polyimide-based resin polymer material and a preparation method and application thereof. Background technique [0002] As a high-performance material and special plastic, polyimide is widely used in high-tech and high-demand fields such as electronics, aerospace, information, energy and military industry. In the field of electronics and electricity, polyimide resin polymer materials are often used in integrated circuits and used as the insulating layer of printed circuit boards. They have high heat resistance (general resins have low heat resistance), flame retardant properties and The advantage of good flexibility is the most commonly used insulating resin polymer material in printed circuit boards. [0003] At present, the conventional polyimide film (hereinafter referred to as PI film) used in the industry does not have the bonding function, and thermoplasti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10
CPCC08G73/1007C08G73/1039C08G73/1042C08G73/1082
Inventor 张维熙陈钰王琼
Owner 成都博斐特新材料有限公司