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A temperature hysteresis protection circuit for intelligent power chips

A technology for intelligent power and protection circuits, which is applied in the direction of adjusting electrical variables, instruments, control/regulation systems, etc., can solve the problems of insufficient temperature sensitivity and high process requirements, and achieve the effect of increasing circuit sensitivity, accurate threshold voltage, and easy realization

Inactive Publication Date: 2018-04-24
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the traditional BTJ hysteresis circuit, there are problems such as insufficient temperature sensitivity and high process requirements.

Method used

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  • A temperature hysteresis protection circuit for intelligent power chips
  • A temperature hysteresis protection circuit for intelligent power chips
  • A temperature hysteresis protection circuit for intelligent power chips

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Embodiment Construction

[0026] The present invention will be described in detail below in conjunction with the drawings.

[0027] Such as figure 1 As shown, the temperature hysteresis protection circuit for smart power chips of the present invention includes a bandgap reference unit and a temperature sensing and hysteresis module;

[0028] The bandgap reference unit includes a first insulated gate bipolar P-type transistor MP1, a second insulated gate bipolar P-type transistor MP2, a third insulated gate bipolar P-type transistor MP3, a first transistor Q1, a second transistor A pole tube Q2, a third triode Q3, a first operational amplifier A1, a first resistor R1 and a second resistor R2;

[0029] The source of the first insulated gate bipolar P-type transistor MP1 is connected to the power source, and the gate thereof is connected to the output terminal of the first operational amplifier A1;

[0030] The source of the second insulated gate bipolar P-type transistor MP2 is connected to the power source, and...

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Abstract

The invention relates to the technical field of integrated circuits, in particular to a novel temperature hysteresis protection circuit for an intelligent power chip. The novel temperature hysteresis protection circuit is characterized by including overtemperature signal output and temperature hysteresis restart, and the problem of thermal oscillation is prevented. Compared with a traditional structure, a subtractor structure is additionally arranged, an isolating and buffering effect is achieved, the anti-jamming capability of signals is enhanced, and meanwhile the sensitivity of the circuit is improved. A hysteresis comparator realized through external positive feedback makes threshold voltage more precise, and realization is easy. The novel temperature hysteresis protection circuit is especially suitable for protection with high temperature requirements in power integrated circuits.

Description

Technical field [0001] The present invention relates to the technical field of integrated circuits, in particular to a temperature hysteresis protection circuit for smart power chips. Background technique [0002] As we all know, smart power chips are gradually being used in motor drive systems due to their small size, low power consumption, and high reliability to achieve energy-saving, environmental protection and compact motor drive. However, the power devices integrated by smart power chips usually work at high voltages. Under current conditions, there are large switching losses and conduction losses, which are easy to cause the chip temperature to rise, and the rise of the chip temperature will increase the on-resistance of the power device, which will lead to increased losses and form positive feedback. In severe cases, it will cause Thermal runaway causes chip failure and severely affects the reliability of the variable frequency motor drive system. [0003] At present, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05F1/569
CPCG05F1/569
Inventor 方健钟皓玥张波周泽坤杨舰
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA