Double-sided flexible copper clad laminate and manufacturing method thereof

Abstract

The invention discloses a production method of a double-sided flexible CCL (copper-clad plate). The production method comprises the following steps: (1) first copper foil, a first fluoropolymer film and a TPI (thermoplastic polyimide) film which are stacked sequentially are subjected to rolling pressing at a low temperature, and a first single-sided flexible CCL with a three-layer structure is obtained; (2) second copper foil and a second fluoropolymer film which are stacked sequentially are subjected to rolling pressing at a low temperature, and a second single-sided flexible CCL with a two-layer structure is obtained; (3) the first single-sided flexible CCL and the second single-sided flexible CCL are subjected to rolling pressing at a high temperature, and the double-sided flexible CCL is obtained, wherein the second fluoropolymer film is arranged on the TPI film. The double-sided flexible CCL obtained with the method has lower dielectric constant and dielectric loss, good heat resistance and excellent mechanical property. The invention further discloses the double-sided flexible CCL produced with the method.

Description

technical field [0001] The invention relates to the field of copper clad laminate production, in particular to a method for producing a double-sided flexible copper clad laminate with low dielectric constant and low dielectric loss and a double-sided flexible copper clad laminate produced by the method. Background technique [0002] With the rapid development of information science and technology, various electronic consumer products with high-speed information processing functions have become an indispensable part of people's daily life, thus accelerating the transfer of wireless communication and broadband application industrial technology from the traditional military field to civilian consumption. The speed of transfer in the electronic field, due to the strong demand in the consumer electronics market, and constantly put forward higher technical requirements, such as high-speed information transmission, completeness, multi-functionality and miniaturization of products, e...

AI Technical Summary

Problems solved by technology

[0003] In terms of the preparation of low dielectric constant (Low Dk) flexible copper clad laminates, the current method generally adopted in the industry is to first manufacture liquid crystal polyester films, and then use high-temperature roller presses to prepare double-sided flexible copper clad laminates at high temperatures. However, the preparation of Low Dk flexible copper clad laminates in this way has its limitations, and the resistance to dip soldering is insufficient. When processing by downstream FPCB manufacturers, the phenomenon of board explosion is prone to occur at 288°C, which will affect the use.

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