Unlock instant, AI-driven research and patent intelligence for your innovation.

Manufacturing method of aluminum-based copper foil-clad laminated board

A technology of aluminum-based copper clad and production methods, which is applied in the field of copper clad laminate manufacturing, can solve problems such as waste of capital costs, complicated processes, and cumbersome copper clad laminate manufacturing processes, and achieve the effects of saving capital costs, simple processes, and improving heat dissipation performance

Inactive Publication Date: 2017-05-17
金宝电子(铜陵)有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the prior art, the manufacturing process of copper clad laminates is cumbersome, and in the manufacturing process, a lot of capital costs are often wasted due to the complicated process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for manufacturing an aluminum-based copper-clad laminate, comprising the following steps:

[0024] Step 1: Prepare raw materials;

[0025] Prepare electronic fiberglass cloth, resin, copper foil, ceramic powder and silicon dioxide, and the composition of the resin includes: 6 parts of epoxy resin, 3 parts of urea-formaldehyde resin, 6 parts of polyethylene resin, ethyl styrene - 2 parts of butadiene-styrene block copolymer, 8 parts of silicone resin and 4 parts of furan resin. The above materials are melted at high temperature according to the proportion to form a mixture resin. The composition of the copper foil is according to The ratio of parts by weight includes: 95 parts of copper, 1.5 parts of silver, 4 parts of aluminum and 0.8 part of gold. The above mixture is melted at high temperature to form a metal mixture, and then die-cast to form copper foil;

[0026] Step 2: Electronic fiberglass cloth impregnated with resin;

[0027] The resin is melted at h...

Embodiment 2

[0033] A method for manufacturing an aluminum-based copper-clad laminate, comprising the following steps:

[0034] Step 1: Prepare raw materials;

[0035] Prepare electronic glass fiber cloth, resin, copper foil, ceramic powder and silicon dioxide, the composition of the resin includes: 2 parts of epoxy resin, 1 part of urea-formaldehyde resin, 4 parts of polyethylene resin, ethyl styrene - 1 part of butadiene-styrene block copolymer, 5 parts of silicone resin and 3 parts of furan resin, the above materials are melted according to the proportion at high temperature to form a mixture resin, and the composition of the copper foil is according to The ratio of parts by weight includes: 90 parts of copper, 1 part of silver, 2 parts of aluminum and 0.5 part of gold. The above mixture is melted at high temperature to form a metal mixture, and then die-cast to form copper foil;

[0036] Step 2: Electronic fiberglass cloth impregnated with resin;

[0037] The resin is melted at high ...

Embodiment 3

[0043] A method for manufacturing an aluminum-based copper-clad laminate, comprising the following steps:

[0044] Step 1: Prepare raw materials;

[0045] Prepare electronic fiberglass cloth, resin, copper foil, ceramic powder and silicon dioxide, and the composition of the resin includes: 4 parts of epoxy resin, 2 parts of urea-formaldehyde resin, 5 parts of polyethylene resin, ethyl styrene - 1-2 parts of butadiene-styrene block copolymer, 6 parts of silicone resin and 3.5 parts of furan resin, the above materials are melted at high temperature according to the proportion, to form a mixture resin, the copper foil The ingredients include: 92 parts of copper, 1.3 parts of silver, 3 parts of aluminum and 0.6 part of gold. The above mixture is melted at high temperature to form a metal mixture, and then die-cast to form copper foil;

[0046] Step 2: Electronic fiberglass cloth impregnated with resin;

[0047] The resin is melted at high temperature to form a solution state, an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a manufacturing method of an aluminum-based copper foil-clad laminated board. The manufacturing method comprises the following steps: step 1: preparing raw materials; step 2: immersing an electronic glass fiber fabric into resin; step 3: coating ceramic powder and silicon dioxide; and step 4: mounting a copper foil. According to the copper-clad board manufactured by the manufacturing method, a process is simple and a lot of investment cost is saved; and the ceramic powder and silicon dioxide are adopted, and then the high heat radiation performance can be improved in a utilization process, so that a phenomenon that the copper-clad board is burnt due to overheating in a post-period utilization process is prevented from occurring.

Description

technical field [0001] The invention relates to the technical field of manufacturing copper-clad laminates, in particular to a method for manufacturing an aluminum-based copper-clad laminate. Background technique [0002] Aluminum-based copper-clad laminate, that is, aluminum substrate, is a kind of raw material. It is made of electronic glass fiber cloth or other reinforcing materials impregnated with resin, single resin, etc. And a plate-like material made is called copper-clad laminated aluminum substrate, or aluminum-based copper-clad laminate for short. [0003] As the substrate material in the manufacture of printed circuit boards, aluminum-based copper-clad laminates mainly play the role of interconnection, conduction, insulation and support for printed circuit boards, and have a great impact on the transmission speed, energy loss and characteristic impedance of signals in the circuit. The performance, quality, processability, manufacturing level, manufacturing cost ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B32B17/02B32B17/06B32B15/20B32B15/14B32B15/04B32B37/10B32B37/06B32B27/04C08L83/04C08L63/00C08L23/06C08L61/24C08L53/02C08L61/00
CPCB32B5/02B32B15/04B32B15/14B32B15/20B32B17/061B32B37/06B32B37/10B32B2255/02B32B2255/20B32B2260/021B32B2260/046B32B2457/08C08L83/04C08L2203/20C08L2205/035C08L63/00C08L23/06C08L61/24C08L53/02C08L61/00
Inventor 孙茂云
Owner 金宝电子(铜陵)有限公司