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A kind of thermally conductive silicone gel and preparation method thereof

A technology of silicone and gel, which is applied in the field of liquid silicone rubber, can solve the problems of low hardness and low thermal expansion rate, and achieve the effect of low hardness, low thermal expansion rate and wide application range

Active Publication Date: 2020-10-13
CHINA BLUESTAR CHENGRAND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention aims to solve the technical problem that the silicone gel in the prior art cannot satisfy good mechanical properties, adhesion and high thermal conductivity at the same time, and provides a new heat-conducting silicone gel. Ratio design, so that the obtained silicone gel has low hardness, low thermal expansion rate, high thermal conductivity and good mechanical properties and construction properties

Method used

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  • A kind of thermally conductive silicone gel and preparation method thereof
  • A kind of thermally conductive silicone gel and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A heat-conducting silicone gel, comprising the following component A in parts by weight: 100 parts of base glue, 7 parts of vinyl silicone oil, 1 part of inhibitor, 2 parts of catalyst, B component: 100 parts of base glue, vinyl 1 part of silicone oil, 4 parts of hydrogen-containing silicone oil, and 5 parts of chain extender; the base rubber includes 100 parts of vinyl silicone oil, 50 parts of flame retardant additives, 250 parts of filler, and 18 parts of silane treatment agent.

[0035] In this embodiment, the kinematic viscosity of the vinyl silicone oil at 25° C. is 3000 Pa·s.

[0036] In this example, the inhibitor is 3-methyl-1-hexynyl-3-ol.

[0037] In this embodiment, the catalyst is a platinum chelate compound of alkenyl siloxane, and the platinum content is 5000 ppm.

[0038] In this embodiment, the structural formula of the chain extender is:

[0039] , where X, Y are CH 3 , H; R 1 , R 2 for CH 3 、C 2 h 5 ; m=100, n=50.

[0040] In this embodimen...

Embodiment 2

[0044] A heat-conducting silicone gel, comprising the following component A in parts by weight: 100 parts of base glue, 6 parts of vinyl silicone oil, 1 part of inhibitor, 3 parts of catalyst, B component: 100 parts of base glue, vinyl 2 parts of silicone oil, 2 parts of hydrogen-containing silicone oil, and 3 parts of chain extender; the rubber base includes 100 parts of vinyl silicone oil, 50 parts of flame retardant additive, 250 parts of filler, and 6 parts of silane treatment agent.

[0045] In this embodiment, the kinematic viscosity of the vinyl silicone oil at 25° C. is 1000 mPa·s.

[0046] In this example, the inhibitor is 2-methyl-3-butynyl-2 alcohol.

[0047] In this embodiment, the catalyst is a chelate compound of chloroplatinic acid and 1,3-divinyltetramethyldisiloxane, and the platinum content is 5000 ppm.

[0048] In this embodiment, the structural formula of the chain extender is:

[0049] , where X and Y are respectively C 2 h 3 , H; R 1 , R 2 Respect...

Embodiment 3

[0055] A heat-conducting silicone gel, comprising the following component A in parts by weight: 100 parts of base glue, 6 parts of vinyl silicone oil, 1 part of inhibitor, 3 parts of catalyst, B component: 100 parts of base glue, vinyl 3 parts of silicone oil, 3 parts of hydrogen-containing silicone oil, and 4 parts of chain extender; the rubber base includes 100 parts of vinyl silicone oil, 150 parts of flame retardant additive, 250 parts of filler, and 5 parts of silane treatment agent.

[0056] In this embodiment, the kinematic viscosity of the vinyl silicone oil at 25° C. is 2000 mPa·s.

[0057] In this example, 1-ethynyl-1-cyclohexanol.

[0058] In this embodiment, the catalyst is a platinum chelate compound of alkenyl siloxane with a platinum content of 3000 ppm.

[0059] In the present embodiment, the structural formula of the chain extender is:

[0060] , where X and Y are respectively C 2 h 3 , H; R 1 , R 2 Respectively CH 3 、C 2 h 5 ; m=50, n=50.

[0061]...

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Abstract

The invention discloses heat-conducting organic silica gel and a preparation method thereof and belongs to the technical field of liquid silicone rubber. The organic silica gel comprises the following components in parts by weight: component A: 100 parts of base glue, 5-7 parts of vinyl silicone oil, 1-3 parts of inhibitors and 1-3 parts of catalysts; component B: 100 parts of base glue, 1-4 parts of vinyl silicone oil, 2-6 parts of hydrogen-containing silicone oil and 0-5 parts of chain extenders, wherein the base glue comprises 100 parts of vinyl silicone oil, 0-50 parts of flame retardant agents, 250-300 parts of fillers and 5-20 parts of silane treating agents. The silica gel disclosed by the invention has low thermal expansion coefficient, low hardness, high heat-conducting property and excellent construction performance, can fully meet the potting usage requirement and is wide in application range and excellent in performance.

Description

technical field [0001] The invention relates to a silicone gel, in particular to a heat-conducting silicone gel and a preparation method thereof, belonging to the technical field of liquid silicone rubber. Background technique [0002] Silicone potting compound is an organosiloxane composition obtained through hydrosilicon addition reaction. After heating and curing, the silicone potting compound shows excellent weather resistance and electrical insulation properties. By adding flame-retardant fillers and heat-conducting fillers, other functions such as heat conduction and electromagnetic shielding have been expanded on the basis of the original performance. Therefore, it is widely used in the potting field of vehicle-mounted or household electronic appliances. [0003] In the use of traditional silicone potting compounds, with the development of microelectronic integrated circuits, electronic components and electronic equipment are rapidly developing towards miniaturizatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/04C08K13/02C08K3/36C08K3/22C08K3/38C09K5/10
CPCC08K2201/003C08K2201/014C08L83/04C08L2201/02C08L2205/025C08L2205/035C09K5/10C08K13/02C08K2003/2224C08K2003/2227C08K3/36C08K2003/385
Inventor 王哲夏志伟王进周远建
Owner CHINA BLUESTAR CHENGRAND CO LTD
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