High-temperature-resistant epoxy adhesive composition and preparation method thereof

An epoxy adhesive, high temperature resistant technology, applied in the direction of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problems of lack of popularization, difficult users, difficult to purchase raw materials, etc., and achieve low price Effect

Inactive Publication Date: 2017-05-31
江苏芯锐传感科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, raw materials are not easy to buy, which causes great

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] This embodiment relates to a method for preparing a high-temperature-resistant epoxy adhesive composition, including the preparation of component A and component B, wherein the preparation of component A includes the following steps:

[0056] According to 40 parts of epoxy resin 618, 50 parts of aluminum hydroxide powder (300 mesh) and 10 parts of silica powder (300 mesh);

[0057] After mixing epoxy resin, aluminum hydroxide powder and silicon dioxide powder, stir evenly.

[0058] The preparation method of B component comprises the steps:

[0059] Dosing according to 60 parts of phosphoric acid, 30 parts of ethylene glycol and 10 parts of water;

[0060] Just mix phosphoric acid, ethylene glycol and water evenly.

[0061] When in use, take the two components according to A: B = 100: (50~100) and stir and mix evenly for construction. After the two components A and B are mixed, the operation time is about 1 hour. The operating time in summer is only about 40 minutes,...

Embodiment 2

[0066] This embodiment relates to a method for preparing a high-temperature-resistant epoxy adhesive composition, including the preparation of component A and component B, wherein the preparation of component A includes the following steps:

[0067] According to 60 parts of epoxy resin 618, 30 parts of aluminum hydroxide powder (300 mesh) and 10 parts of silica powder (300 mesh);

[0068] After mixing epoxy resin, aluminum hydroxide powder and silicon dioxide powder, stir evenly.

[0069] The preparation method of B component comprises the steps:

[0070] Dosing according to 70 parts of phosphoric acid, 20 parts of ethylene glycol and 10 parts of water;

[0071] Just mix phosphoric acid, ethylene glycol and water evenly.

[0072] When in use, take the two components according to A: B = 100: (50~100) and stir and mix evenly for construction. After the two components A and B are mixed, the operation time is about 1 hour. The operating time in summer is only about 40 minutes,...

Embodiment 3

[0077] This embodiment relates to a method for preparing a high-temperature-resistant epoxy adhesive composition, including the preparation of component A and component B, wherein the preparation of component A includes the following steps:

[0078] According to 50 parts of epoxy resin 618, 40 parts of aluminum hydroxide powder (300 mesh) and 10 parts of silica powder (300 mesh);

[0079] After mixing epoxy resin, aluminum hydroxide powder and silicon dioxide powder, stir evenly.

[0080] The preparation method of B component comprises the steps:

[0081] Dosing according to 65 parts of phosphoric acid, 25 parts of ethylene glycol and 10 parts of water;

[0082] Just mix phosphoric acid, ethylene glycol and water evenly.

[0083] When in use, take the two components according to A: B = 100: (50~100) and stir and mix evenly for construction. After the two components A and B are mixed, the operation time is about 1 hour. The operating time in summer is only about 40 minutes,...

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Abstract

The invention relates to a high-temperature-resistant epoxy adhesive composition and a preparation method thereof. The high-temperature-resistant epoxy adhesive composition comprises a component A consisting of epoxy resin, aluminum hydroxide and silicon dioxide, and a component B consisting of phosphoric acid, ethanediol and water. After mixing and glue regulating are performed in proportion, primary solidification is performed under a room temperature environment for hours, and the solidification is complete after 12 hours. Finished high-molecular solids can resist high temperature of 300 DEG C, and can resist instantaneous high temperature of 350 DEG C.

Description

technical field [0001] The invention relates to a high-temperature-resistant epoxy adhesive composition and a preparation method thereof, belonging to the technical field of adhesives. Background technique [0002] At present, there are many formulations of epoxy resin formulated into high temperature resistant epoxy glue, but the curing temperature is high, and the use temperature after curing is only 200°C. [0003] For example, the epoxy high temperature resistant adhesive for aerospace has the following formula: [0004] Four functional epoxy resin (TGDDM) 100; [0005] Curing agent (DDS) 10~20; [0006] Other additives in appropriate amount; [0007] The curing process of the epoxy glue prepared by this formula is 150°C for 2 hours, then 180°C for 2 hours, and finally 200°C for 10 hours to complete the final curing. Its use temperature is 200°C. [0008] There is also an epoxy adhesive formulation that can withstand both low and high temperatures. [0009] Epoxy...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06
CPCC08K3/22C08K3/32C08K3/36C08K5/053C08K13/02C08K2003/2227C08K2003/329C09J11/04C09J11/06C09J163/00
Inventor 康健季婧立
Owner 江苏芯锐传感科技有限公司
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