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High-temperature-resistant epoxy adhesive composition and preparation method thereof

An epoxy adhesive, high temperature resistant technology, applied in the direction of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problems of lack of popularization, difficult users, difficult to purchase raw materials, etc., and achieve low price Effect

Inactive Publication Date: 2017-05-31
江苏芯锐传感科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, raw materials are not easy to buy, which causes great difficulties for users. In other words, it lacks popularization.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] This embodiment relates to a method for preparing a high-temperature-resistant epoxy adhesive composition, including the preparation of component A and component B, wherein the preparation of component A includes the following steps:

[0056] According to 40 parts of epoxy resin 618, 50 parts of aluminum hydroxide powder (300 mesh) and 10 parts of silica powder (300 mesh);

[0057] After mixing epoxy resin, aluminum hydroxide powder and silicon dioxide powder, stir evenly.

[0058] The preparation method of B component comprises the steps:

[0059] Dosing according to 60 parts of phosphoric acid, 30 parts of ethylene glycol and 10 parts of water;

[0060] Just mix phosphoric acid, ethylene glycol and water evenly.

[0061] When in use, take the two components according to A: B = 100: (50~100) and stir and mix evenly for construction. After the two components A and B are mixed, the operation time is about 1 hour. The operating time in summer is only about 40 minutes,...

Embodiment 2

[0066] This embodiment relates to a method for preparing a high-temperature-resistant epoxy adhesive composition, including the preparation of component A and component B, wherein the preparation of component A includes the following steps:

[0067] According to 60 parts of epoxy resin 618, 30 parts of aluminum hydroxide powder (300 mesh) and 10 parts of silica powder (300 mesh);

[0068] After mixing epoxy resin, aluminum hydroxide powder and silicon dioxide powder, stir evenly.

[0069] The preparation method of B component comprises the steps:

[0070] Dosing according to 70 parts of phosphoric acid, 20 parts of ethylene glycol and 10 parts of water;

[0071] Just mix phosphoric acid, ethylene glycol and water evenly.

[0072] When in use, take the two components according to A: B = 100: (50~100) and stir and mix evenly for construction. After the two components A and B are mixed, the operation time is about 1 hour. The operating time in summer is only about 40 minutes,...

Embodiment 3

[0077] This embodiment relates to a method for preparing a high-temperature-resistant epoxy adhesive composition, including the preparation of component A and component B, wherein the preparation of component A includes the following steps:

[0078] According to 50 parts of epoxy resin 618, 40 parts of aluminum hydroxide powder (300 mesh) and 10 parts of silica powder (300 mesh);

[0079] After mixing epoxy resin, aluminum hydroxide powder and silicon dioxide powder, stir evenly.

[0080] The preparation method of B component comprises the steps:

[0081] Dosing according to 65 parts of phosphoric acid, 25 parts of ethylene glycol and 10 parts of water;

[0082] Just mix phosphoric acid, ethylene glycol and water evenly.

[0083] When in use, take the two components according to A: B = 100: (50~100) and stir and mix evenly for construction. After the two components A and B are mixed, the operation time is about 1 hour. The operating time in summer is only about 40 minutes,...

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Abstract

The invention relates to a high-temperature-resistant epoxy adhesive composition and a preparation method thereof. The high-temperature-resistant epoxy adhesive composition comprises a component A consisting of epoxy resin, aluminum hydroxide and silicon dioxide, and a component B consisting of phosphoric acid, ethanediol and water. After mixing and glue regulating are performed in proportion, primary solidification is performed under a room temperature environment for hours, and the solidification is complete after 12 hours. Finished high-molecular solids can resist high temperature of 300 DEG C, and can resist instantaneous high temperature of 350 DEG C.

Description

technical field [0001] The invention relates to a high-temperature-resistant epoxy adhesive composition and a preparation method thereof, belonging to the technical field of adhesives. Background technique [0002] At present, there are many formulations of epoxy resin formulated into high temperature resistant epoxy glue, but the curing temperature is high, and the use temperature after curing is only 200°C. [0003] For example, the epoxy high temperature resistant adhesive for aerospace has the following formula: [0004] Four functional epoxy resin (TGDDM) 100; [0005] Curing agent (DDS) 10~20; [0006] Other additives in appropriate amount; [0007] The curing process of the epoxy glue prepared by this formula is 150°C for 2 hours, then 180°C for 2 hours, and finally 200°C for 10 hours to complete the final curing. Its use temperature is 200°C. [0008] There is also an epoxy adhesive formulation that can withstand both low and high temperatures. [0009] Epoxy...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06
CPCC08K3/22C08K3/32C08K3/36C08K5/053C08K13/02C08K2003/2227C08K2003/329C09J11/04C09J11/06C09J163/00
Inventor 康健季婧立
Owner 江苏芯锐传感科技有限公司
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