Conductive silver glue, preparation method and application thereof

Abstract

The invention relates to conductive silver glue, the conductive silver glue comprises the following components by weight: 0.1-60 parts of an ionic liquid, 50-85 parts of silver powder, 10-50 parts of epoxy resin, 0.5-60 parts of a curing agent, 0.05-5 parts of an accelerator, 0.05-5 parts of a coupling agent, 1-10 parts of a diluent and 0.05-2 parts of an anti settling agent. The ionic liquid with catalytic activity is introduced into a conductive adhesive formula to promote the further curing of the epoxy resin, improve the volume shrinkage rate and greatly improve the conductivity of the conductive silver glue. By addition of the same amount of silver powder, the conductivity of the conductive silver glue is greatly increased (to 10<-5> orders of magnitudes and to reach a higher level in the market); the dispersion of a conductive filler is promoted, the viscosity of the conductive silver glue is reduced, and the operating performance of the product is improved. The method has the advantages of simple operation and low material cost, the cost of the conductive silver glue is reduced, and the conductive silver glue can be widely used in solar cells, integrated circuits and LED packaging and other fields.

Description

technical field [0001] The invention belongs to the field of semiconductor materials, and relates to a conductive silver paste and a preparation method and application thereof. Background technique [0002] As a substitute for traditional packaging materials in the field of electronic packaging - solder, conductive adhesive has many advantages: environmentally friendly, no toxic metals, no need for pre-cleaning and post-solder cleaning in the process; mild curing temperature, which greatly reduces thermal damage to electronic devices and Internal stress, especially suitable for heat-sensitive materials and non-weldable materials; high line resolution, its line resolution below 200μm is more suitable for fine pitch manufacturing. The many advantages of conductive adhesives adapt to the development trend of miniaturization, thinning and integration of electronic devices, and are widely used in IC packaging, LED packaging, solar cells, radio frequency antennas and other microel...

AI Technical Summary

Problems solved by technology

Although conductive adhesives have replaced tin-lead solders in many electronic fields, there are still some disadvantages: high volume resistivity, insufficient bonding strength, poor storage and transportation performance, etc.

In order to improve the conductivity of conductive adhesives, people often increase the content of metal fillers (65%-90%). Although it can increase its conductivity to a certain extent, it will also lose some mechanical properties due to the reduction of resin content. The viscosity of the conductive adhesive is reduced, the bonding strength and operating performance are reduced, and the cost of the conductive adhesive is greatly increased

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