Free-cutting bismuth-silicon-tin brass remelting and polishing copper ingot and manufacturing method thereof

Abstract

The invention discloses a free-cutting bismuth-silicon-tin brass remelting and polishing copper ingot. The copper ingot comprises, by weight, 59.0-62.0% of copper, 0.4-1.2% of bismuth, 0.2-0.6% of silicon, 0.1-0.5% of tin, 0.5-0.8% of aluminum, 0.01-0.14% of arsenic, 0.06-0.2% of iron, 0.0005-0.0025% of boron, 0.005-0.05% of tellurium, no more than 0.10% of lead, no more than 0.20% of nickel, no more than 0.01% of cadmium, 0.025-0.15% of a modificator, and the balance zinc. The modificator is aluminum-boron alloy and a rare earth modificator. The metallographic structure characteristic of bismuth brass can be obviously changed, so that the mechanical property of the bismuth brass is effectively improved, and the problems that the mechanical property of the bismuth brass is low, and casting pieces are prone to cracking during casting forming and processing and use are effectively solved. The prepared free-cutting bismuth-silicon-tin brass remelting and polishing copper ingot is low in cost, environmentally friendly and healthy, and meets the lead-free upgrading and updating requirements of copper alloy materials of components, in contact with water, of water-heating bathroom facilities.

Description

technical field [0001] The invention relates to the field of metal materials, in particular to a novel free-to-cut bismuth-silicon-tin brass remelted polished copper ingot and a manufacturing method thereof. Background technique [0002] Lead-free and easy-cutting bismuth-silicon-tin brass is a brass alloy based on copper and zinc with a certain amount of bismuth, tin, aluminum, silicon, arsenic, etc., and bismuth is used instead of lead. Its cutting performance is equivalent or close to that of lead brass. Casting forming and processing performance is excellent. However, due to the extremely low solid solubility of bismuth in copper, the bismuth brass that has been developed and used at present is prone to component segregation during the smelting process, which affects the internal quality of the ingot. Bismuth is often distributed on the brass grain boundary in the form of a brittle film, which produces both hot and cold brittleness, which is easy to cause cracking durin...

AI Technical Summary

Problems solved by technology

However, due to the extremely low solid solubility of bismuth in copper, the bismuth brass that has been developed and used at present is prone to segregation of components during the smelting process, which affects the internal quality of the ingot.

Bismuth is often distributed on the grain boundaries of brass in the form of a brittle film, which produces both hot and cold brittleness, which is easy to cause cracking during cold and hot processing, which restricts its application

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