Composite heat dissipation device

Abstract

The invention discloses a composite heat dissipation device. The device comprises a flat plate heat tube and multiple sandwiched phase transition material composite boards. The evaporation end of the flat plate heat tube is used for taking heat from a heating element. The condensation end of the flat plate heat tube is connected with base parts of the sandwiched phase transition material composite boards. A multi-hole capillary liquid adsorbing core layer is arranged on the inner wall of the evaporation end. A bionic capillary liquid adsorbing core is arranged on the multi-hole capillary liquid adsorbing core layer. Each sandwiched phase transition material composite board comprises an enclosed inner cavity. Phase transition materials are arranged in each inner cavity. The side wall of each inner cavity is a metal plate. According to the invention, the flat plate heat tube with the capillary liquid adsorbing core has good temperature averaging ability; through the phase transition materials, temperature peaks are inhibited, so normal work of the whole electronic device is ensured; and through the integrated design of the flat plate heat tube and the sandwiched phase transition material composite boards, contact thermal resistance between a traditional flat plate heat tube and a heat sink is eliminated. In one word, the heat dissipation device is better in temperature averaging ability, stronger in heat dissipation ability, high in safety and simple to process.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, and more specifically, to a composite heat dissipation device. Background technique [0002] With the development of industrial electronics and semiconductor science and technology, high-power electronic and optical devices (such as LED), power batteries, computer CPU / GPU (hereinafter referred to as electronic equipment) are constantly developing towards miniaturization and integration, resulting in The rapid increase of heat production, the sharp increase of local heat flux, and the uneven distribution of heat flow occur. If the heat cannot be discharged in time and the electronic equipment is heated unevenly, it will have a significant impact on the stability, reliability and life of the electronic equipment. The traditional heat dissipation method of simply using metal plates and air forced convection cooling has reached its heat transfer limit, and the heat dissipation problem has be...

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Problems solved by technology

[0005] In view of this, the object of the present invention is to provide a composite heat dissipation device, the structural design of which can effectively solve the problem that the heat dissipation device is difficult to meet the heat dissipation requirements of electronic equipment and cause the electronic equipment to burn easily

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