Method for repairing copper film sample fatigue damage by multiple vibration treatment

A technology of fatigue damage and multiple vibrations, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve the problems of poor repair effect and achieve remarkable results, easy operation, and simple process

Active Publication Date: 2017-06-06
BEIJING UNIV OF TECH
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

This method has achieved a good repair effect for single vibration repair, but in practical application

Method used

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  • Method for repairing copper film sample fatigue damage by multiple vibration treatment
  • Method for repairing copper film sample fatigue damage by multiple vibration treatment
  • Method for repairing copper film sample fatigue damage by multiple vibration treatment

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Embodiment Construction

[0027] Below in conjunction with accompanying drawing, the method of the present invention is further elaborated by giving an example, please refer to Figure 1 to Figure 4 . A pulsating cyclic load with a maximum stress of 180 MPa is applied to the specimen, and the cyclic loading time is 0.5 times the original life of the specimen, and then it is subjected to multiple vibration repairs until the specimen breaks. A method for repairing copper thin film fatigue damage by multiple vibration treatment, the steps are:

[0028] Step 1) provide a vibration treatment repair device, the vibration treatment repair device includes a test piece isolation device 1, a mode exciter 2, a power amplifier 3 and a waveform generator 4; the test piece isolation device 1 and the mode excitation The vibrating table of the device 2 is rigidly fixed together; the modal exciter 2 is connected to the power amplifier 3; the waveform generator 4 is connected to the power amplifier 3, and both are conn...

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Abstract

The invention discloses a method for repairing copper film sample fatigue damage by multiple vibration treatment, and belongs to the technical field of machinery manufacture and vibration treatment application. A device comprises a sample isolating device, a modal exciter, a power amplifier and a signal generator. According to the method, fatigue damage processes of original samples are statically analyzed and simulated by the aid of finite element analysis software, vibration treating processes are analyzed and simulated by the aid of transient dynamics, stress conditions of the samples are analyzed, so that optimal repairing effects and corresponding parameters are acquired, changes of microstructures of the inside of the copper film samples are different after fatigue damage is formed once, transient analysis is performed by the finite element analysis software, so that vibration repairing and treating tests are simulated, the optimal repairing effects and the corresponding parameters are acquired, and each acquired optimal parameters serve as device output parameters. According to the method, multiple vibration repairing treatment tests are guided by the optimal parameters acquired in a finite element simulation manner, damage of the samples is constantly wiped, and each repairing effect is optimal, so that remaining life is continuously prolonged.

Description

technical field [0001] The invention belongs to the technical field of mechanical manufacturing and vibration treatment application, and particularly proposes a method for repairing fatigue damage of a copper thin film test piece through multiple vibration treatments. Background technique [0002] The basic idea of ​​vibration aging is to release the internal stress of the workpiece by applying cyclic load to the stressed workpiece, so as to reduce the residual stress of the workpiece and stabilize the size to achieve the purpose of aging. It can effectively heal the fatigue damage of metal components, prolong its fatigue life, and has a short production cycle, flexible processing locations, less energy consumption, and no environmental pollution, so it has great practical value and engineering significance. Copper thin films are widely used in large-scale integrated circuits and micro-electromechanical systems. During service, they are often invalidated or even destroyed by...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/17G06F30/23G06F2119/04
Inventor 尚德广张子骁张海萌刘亚楠吕帅
Owner BEIJING UNIV OF TECH
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