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A low-temperature sintering infrared frequency modulation resistor paste and preparation method thereof
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A resistance paste, low-temperature sintering technology, used in cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. Economic value, the effect of simple preparation process
Inactive Publication Date: 2018-07-13
DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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[0003] There are a variety of circuit paste products in the prior art; however, for the existing circuit paste products, more considerations are sintering time, scope of application, energy saving and environmental protection, resistance value, adhesion, solderability However, insufficient attention has been paid to the wavelength selectivity of electrothermal radiation, and there have been no reports
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Embodiment 1
[0021] Embodiment 1 This embodiment discloses a low-temperature sintering infrared frequency modulation resistor paste, which includes the following materials by weight, specifically:
[0024] The solid phase is composed of silver powder (100nm), low melting point glass powder and Mg 2 Al 4 Si 5 O 16 Composition, the weight of the solid phase is 75%, 15%, 10%;
[0025] The organic binder phase is composed of ethyl cellulose, dibasic acid ester, dispersant, defoamer, leveling agent, thixotropic agent, and the weight parts are 35%, 60%, 1.5%, 0.5%, 1%, 2%.
[0026] Low melting glass powder includes Bi 2 O 3 , TeO 2 , ZnO, SnO 2 , CaO, BaO, the parts by weight are 40%, 40%, 5%, 5%, 5%, 5%.
[0027] This embodiment also discloses the preparation method of the low-temperature sintering infrared frequency modulation resistor paste, which includes the following process steps, specifically:
[0028] a. Preparation of low-melting glass p...
Embodiment 2
[0030] Embodiment 2 This embodiment discloses a low-temperature sintering infrared frequency modulation resistor paste, which includes the following materials by weight, specifically:
[0033] The solid phase consists of silver powder (1μm), low melting glass powder and Co 0.6 Zn 0.4 Ni 0.8 Fe 1.2 O 4 Composition, the weight of the solid phase is 70%, 15%, 15%;
[0034] The organic binder phase is composed of ethyl cellulose, terpineol, dispersant, defoamer, leveling agent, and thixotropic agent. The weight parts are 10%, 85%, 1.5%, 1%, 1%, 1.5 %.
[0035] Low melting glass powder includes Bi 2 O 3 , TeO 2 , ZnO, SnO 2 , CaO, BaO, the parts by weight are 45%, 42%, 4%, 3%, 3%, 3%.
[0036] This embodiment also discloses the preparation method of the low-temperature sintering infrared frequency modulation resistor paste, which includes the following process steps, specifically:
[0037] a. Preparation of low-melting glass powder: ...
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Abstract
The present invention belongs to the electronic material technology field, in particular relates to a low temperature sinteringInfraredfrequency modulation resistance paste and a preparation method thereof. A resistance paste is composed of 35-85 weight parts of solid phase and 15-65 weight parts of organic binding phase; the solid phase is composed of the metalpowder, the low-melting-point glass powder and an infraredfrequency modulation agent, and the mass ratio of the metalpowder, the low-melting-point glass powder and the infraredfrequency modulation agent is 70-90:1-20:1-20; the organic binding phase is composed of the resin, a solvent and an auxiliary, and the mass ratio of the resin, the solvent and the auxiliary is 5-50:10-90:0.8-10. According to the present invention, by combining the low-melting-point glass powder, the paste has a low temperature sintering characteristic and can be widely suitable for the base materials, such as the stainless steel, the ceramic, the mica, the organic polymer, etc. The paste uses an infrared frequency modulation material which has the high emissivity at the frequency bands of 8-14 micrometers, thereby being beneficial to the human health. The paste is environment friendly, is simple in preparation technology, saves the energy, and has the great market prospect and economic value.
Description
Technical field [0001] The invention belongs to the technical field of electronic materials, and specifically relates to a low-temperature sintered infrared frequency modulation resistorslurry and a preparation method thereof. Background technique [0002] Circuit paste is the basic material for manufacturing thick film components. It is a paste (which can be thought of as toothpaste, paint, etc.) that is uniformly mixed by solid powder and organic solvent through three-roll rolling; among them, according to different uses, Circuit paste can be divided into dielectric paste, resistance paste and conductive paste: according to the different types of substrates, circuit pastes can be divided into ceramic substrates, polymer substrates, glass substrates, and metal insulation substrates. Paste, etc.; according to the different sintering temperature, the circuit paste can be divided into high temperature, medium temperature and low temperature drying circuit paste; according to diffe...
Claims
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Application Information
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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 蒋国辉苏冠贤
Owner DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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