Ultrathin electronic foamed plastic adhesive tape and production method thereof

Abstract

The invention relates to an ultrathin electronic foamed plastic adhesive tape which comprises a foamed plastic substrate. The foamed plastic adhesive tape is sequentially composed of a pressure-sensitive adhesive layer, a corona treatment layer, a foamed plastic substrate, an corona treatment layer, a pressure-sensitive adhesive layer and double silicon release paper from top to bottom, wherein the thickness of the foamed plastic is 100+ / -10 mu m, and the high-density foamed plastic is used as the preferred substrate; and the foamed plastic has higher elasticity and stiffness due to high density, and can achieve favorable filling and cushioning effects even if the thickness is not increased, thereby breaking through the recognition of people on the larger thickness of the traditional foamed plastic adhesive tape in the past. The added sodium bicarbonate particle / carbon powder mixture can effectively improve the heat dissipation mode inside the foamed plastic substrate and obviously enhance the heat dissipation effect, thereby providing the novel ultrathin electronic foamed plastic adhesive tape with favorable heat dissipation function.

Description

technical field [0001] The invention relates to a foam tape, in particular to an ultra-thin electronic foam tape and a production method thereof. Background technique [0002] The design of electronic products such as laptops, tablets, and smartphones continues to become thinner and smaller, so internal parts must also be adjusted accordingly, and one of the internal parts, foam tape, has also undergone considerable changes. Foam tape is an indispensable key material. Its purpose is to fill gaps and cushion. Any two hard objects need to be filled with or cushioned materials to avoid damage to electronic products caused by accidental collisions or falls. Traditional foam tape Low density, poor elasticity, and softness. In order to achieve a good filling or cushioning effect, the thickness of the foam is generally relatively thick. With the trend of thinner and smaller electronic products becoming more and more obvious, we can break through the tradition in material selection ...

AI Technical Summary

Problems solved by technology

Foam tape is an indispensable key material. Its purpose is to fill the gap and cushion. Any two hard objects need to be filled with or cushioned to avoid damage to electronic products caused by accidental collision or falling. Traditional foam tape Low density, poor elasticity, and softness. In order to achieve a good filling or cushioning effect, the thickness of the foam is generally relatively thick. With the trend of thinner and smaller electronic products becoming more and more obvious, we can break through the tradition in material selection and choose foam High-density foam can improve the overall elasticity and stiffness to reduce the required thickness of the foam, but high-density foam also has obvious defects, that is, the surface is too smooth and cannot be well bonded with the adhesive, and then it is easy to cause coating degumming

[0003] At the same time, the existing adhesive tapes are mainly used in electronic components. Electronic components are often in high-temperature working conditions. The tapes in the prior art often only play the role of sealing and fixing, not only can not conduct heat well, but also is not conducive to heat dissipation because of its heat insulation; therefore, how to improve the existing tapes to achieve ideal heat dissipation performance is a Technical problems that need to be solved urgently in this field

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