Power module with high heat reliability

A power module and reliability technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problem of uneven temperature distribution of power chips without improvement, without considering uneven current density of power chips, reducing power chips temperature etc.

Inactive Publication Date: 2017-06-13
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These methods are not only time-consuming and labor-intensive, but also only reduce the temperature of the power chip as a whole, without considering the pr

Method used

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  • Power module with high heat reliability
  • Power module with high heat reliability
  • Power module with high heat reliability

Examples

Experimental program
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Effect test

Example Embodiment

[0023] A power module 100 with high thermal reliability includes: a heat dissipation base plate 3, on which a copper-clad ceramic base plate 5 is provided. The copper-clad ceramic base plate 5 includes a ceramic base plate 5.2, which is on the lower surface of the ceramic base plate 5.2 There is a copper clad 5.3 on the lower surface, and at least two terminals 2 are provided on the copper clad ceramic substrate 5. The terminals 2 are connected to the copper clad 5.1 on the upper surface of the ceramic substrate 5.2 located below the terminals 2. A power chip 6 is connected to the copper-clad 5.1 under one of the two terminals 2 that need to be connected, and the power chip 6 is connected to the other terminal of the two terminals 2 that need to be connected through a wire bonding assembly 7.2 The connection is characterized in that the welding wire assembly 7.2 is composed of mutually parallel welding wires, one end of the welding line is welded to the power chip 6, and the oth...

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Abstract

The invention discloses a power module with the high heat reliability. The power module comprises a heat dissipation bottom plate; a copper-covering ceramic substrate is arranged on the heat dissipation bottom plate, and comprises a ceramic substrate body, a lower-surface copper covering part is arranged on the lower surface of the ceramic substrate body, at least two terminals are arranged on the copper-covering ceramic substrate, the terminals are connected on an upper-surface copper covering part located below the terminals and arranged on the ceramic substrate body, and a power chip is connected on a copper covering part below one of the two terminals needing to be connected, and is connected with the other terminal of the two terminals needing to be connected through a bonding wire assembly; the power module with the high heat reliability is characterized in that the bonding wire assembly is formed by mutually-parallel bonding wires, all the bonding wires have multiple welding spots, the end welding spots of the different bonding wires and middle welding spots located at same opposite positions are arranged on the power chip in a staggered mode; a high-conductivity metal material Al or Cu or Ag or Au is used in the bonding wire assembly.

Description

technical field [0001] The invention relates to a power module with high thermal reliability, in particular to a welding wire in the power module. By improving the wire bonding structure, the problem of high junction temperature of power devices can be better suppressed, and at the same time, the temperature distribution can be uniformed, the aging speed of the module can be delayed, the number of cycles that the device can work can be increased, and the service life can be improved. Background technique [0002] The rapid development of power devices and their packaging technology has brought about great changes in the field of power electronics technology. Power modules are winning more and more markets due to their advantages of high reliability, low loss, and low development costs. [0003] The power module is a whole formed by combining and filling multiple discrete power devices, and is electrically connected through welding wires. In actual work and application, the ...

Claims

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Application Information

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IPC IPC(8): H01L23/49
CPCH01L24/48H01L24/49H01L2224/48106H01L2224/48096H01L2224/48157H01L2224/48456H01L2224/49175H01L2224/45124
Inventor 刘斯扬宋海洋李胜戴志刚魏家行孙伟锋陆生礼时龙兴
Owner SOUTHEAST UNIV
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