P-type PERC double-sided solar cell and module, system and preparation method thereof
A solar cell and double-sided technology, applied in the field of solar cells, can solve the problems of complex N-type double-sided cell technology and high price of N-type silicon wafers, and achieve the effects of improving photoelectric conversion efficiency, high photoelectric conversion efficiency, and easy promotion.
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Embodiment approach
[0077] It should be noted that the first laser grooving unit 81 has multiple implementations, including:
[0078] (1) Each group of first laser grooving units 81 includes a first laser grooving body 82 arranged in the horizontal direction. At this time, the first laser grooving units 81 are continuous linear grooving areas, specifically as Image 6 shown. A plurality of first laser grooving units 81 are arranged vertically.
[0079] (2) Each group of first laser grooving units 81 includes a plurality of first laser grooving bodies 82 arranged in the horizontal direction. At this time, the first laser grooving units 81 are line-segment non-continuous linear grooving areas, specifically Such as Figure 5 shown. The plurality of first laser grooved bodies 82 may be two, three, four or more, but not limited thereto. A plurality of first laser grooving units 81 are arranged vertically.
[0080] When each group of first laser grooving units 81 includes a plurality of first lase...
Embodiment 1
[0124] (1) Form a suede surface on the front and back of the silicon wafer, and the silicon wafer is P-type silicon;
[0125] (2) Diffusion of the silicon wafer to form an N-type emitter;
[0126] (3) Remove the front phosphosilicate glass and surrounding PN junctions formed during the diffusion process;
[0127] (4) Deposit aluminum oxide film on the back of the silicon wafer;
[0128] (5) Deposit a silicon nitride film on the back of the silicon wafer;
[0129] (6) Deposit a silicon nitride film on the front side of the silicon wafer;
[0130] (7) Laser grooving the back of the silicon wafer to form a first laser grooving area, the first laser grooving area includes multiple groups of first laser grooving units arranged in the horizontal direction, and each group of first laser grooving units Including one or more first laser grooved bodies arranged in the horizontal direction, the length of the first laser grooved body is 1000 microns, and the width is 40 microns;
[01...
Embodiment 2
[0138] (1) Form a suede surface on the front and back of the silicon wafer, and the silicon wafer is P-type silicon;
[0139] (2) Diffusion of the silicon wafer to form an N-type emitter;
[0140] (3) Remove the front phosphosilicate glass and surrounding PN junctions formed by the diffusion process, and polish the back of the silicon wafer;
[0141] (4) Deposit aluminum oxide film on the back of the silicon wafer;
[0142] (5) Deposit a silicon nitride film on the back of the silicon wafer;
[0143] (6) Deposit a silicon nitride film on the front side of the silicon wafer;
[0144] (7) Laser grooving the back of the silicon wafer to form a first laser grooving area, a second laser grooving area and a third laser grooving area, the first laser grooving area includes multiple groups of first Laser grooving units, each group of first laser grooving units includes one or more first laser grooving bodies arranged in the horizontal direction, the length of the first laser groovi...
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