Multiphase dielectric layer capacitive pressure sensor with microstructure and preparation method thereof

A pressure sensor and microstructured technology, applied in the field of sensors, can solve the problems of high cost, flexible sensor sensitivity to be improved, sensitivity to be improved, etc., and achieve high reliability

Active Publication Date: 2017-06-30
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
View PDF7 Cites 38 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual mechanism research and product development, we found that there are still some problems: such as the sensitivity needs to be improved, the detection range is limited, the production process is complicated, and the cost is high.
At present, flexible sensors still have problems such as sensitivity to be improved, limited monitoring range, complicated manufacturing process, and high cost.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multiphase dielectric layer capacitive pressure sensor with microstructure and preparation method thereof
  • Multiphase dielectric layer capacitive pressure sensor with microstructure and preparation method thereof
  • Multiphase dielectric layer capacitive pressure sensor with microstructure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0065] The structure of a capacitive pressure sensor with a microstructured multi-phase dielectric layer involved in some more specific embodiments of the present invention can be as follows figure 1 As shown, the preparation process may include: providing two flexible substrates with inverted pyramid microstructures, the flexible nano-electrodes are placed on the flexible substrates with inverted pyramid microstructures by thermal evaporation, printing, and spraying. The first surface of the bottom is used to form electrodes, and lead wires are drawn out; at least two flexible electrodes are respectively electrically contacted with the multi-phase dielectric layer, and the at least two flexible electrodes are arranged at intervals; in some more specific embodiments In this method, two flexible substrates covered with an air-microsphere two-phase dielectric layer are stacked face to face to obtain the microstructured multiphase dielectric layer capacitive pressure sensor. The ...

Embodiment 1

[0081] Weigh 10g of polydimethylsiloxane prepolymer and 1g of cross-linking agent, stir for 20min, remove air bubbles, use silicon wafer as template, spin coat, cure, and reshape to obtain a flexible substrate with an inverted pyramid.

Embodiment 2

[0083] Spray 0.05g / L SWNTs / DMF solution on the flexible substrate, remove the solvent at 80-150°C to obtain flexible electrodes, and draw out leads. Spray PS / ethanol solution on the above-mentioned flexible substrate, remove the ethanol solvent, and obtain an air-microsphere multiphase dielectric layer with a thickness of 3-12 μm; stack the upper and lower flexible substrates face to face, and place them on the edge of the flexible substrate A capacitive pressure sensor with a microstructured multiphase dielectric layer is prepared by coating a biocompatible flexible encapsulation layer. The results show that there is a large amount of air between the microspheres, which is beneficial to the mutual transformation of the air and the microspheres in the dielectric layer, so as to achieve the change of the dielectric constant and improve the sensitivity of the sensor. On this basis, by drawing two electrodes on the surface of the flexible substrate, and coating the edge of the fl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
lengthaaaaaaaaaa
widthaaaaaaaaaa
heightaaaaaaaaaa
Login to view more

Abstract

The invention discloses a multiphase dielectric layer capacitive pressure sensor with a microstructure and a preparation method thereof. The pressure sensor comprises the components of two flexible electrodes which are oppositely arranged, wherein at least one in two opposed surfaces of the two flexible electrodes has the microstructure which is formed by a plurality of projections and/or recessed parts; and a multiphase dielectric layer which is arranged between the two flexible electrodes, wherein the multiphase dielectric layer comprises a micro-ball dielectric layer which is formed by a plurality of micro-balls that can freely move and air and/or flexible polymer that are filled in the micro-ball dielectric layer. The multiphase dielectric layer capacitive pressure sensor with the microstructure has advantages of small thickness, high softness, etc. The multiphase dielectric layer capacitive pressure sensor can be machined to various shapes and has advantages of wearability and adhesiveness. The multiphase material is used as the dielectric layer, thereby improving device sensitivity and reducing least measurement pressure.

Description

technical field [0001] The invention relates to a pressure sensor, in particular to a capacitive pressure sensor with a microstructured multi-phase dielectric layer and a manufacturing method, belonging to the technical field of sensors. Background technique [0002] In recent years, with the development of flexible electronics, flexible sensors used in tactile sensors for prosthetics, intelligent robots, and health monitoring have attracted extensive attention due to their excellent performance. Since the electronic skin with tactile sensing function was first applied to robots in 1991, the development of light, thin, flexible and high-sensitivity new flexible sensors has become a cutting-edge scientific research direction. In the past 15 years, with the continuous application of new principles, new materials, and new processes in the research and development of flexible sensors, the development of flexible sensors has attracted worldwide attention. However, in the actual ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/14
CPCG01L1/142
Inventor 张珽罗袆李铁刘林顾杨
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products