Substrate processing method and substrate processing apparatus

Abstract

The present invention provides a technique capable of preventing a position where a substrate is exposed from shifting from a normal position during pattern exposure. In the substrate processing method of the present invention, the back surface of the substrate before pattern exposure is polished to roughen the back surface, and the substrate is a semiconductor wafer. In addition, no treatment for reducing roughness was performed on the polished rear surface. Through this surface roughening treatment, the contact area between the mounting table that absorbs the substrate and mounts the substrate at the time of exposure and the back surface of the substrate is reduced. Therefore, the back surface of the adsorbed substrate can slide on the mounting table, and the surface of the mounting table can be eliminated. deformation of the substrate. As a result, deviation of the exposure position of the substrate from the normal position can be suppressed, and an improvement in exposure overlap can be achieved.

Description

technical field [0001] The present invention relates to a substrate processing method and a substrate processing apparatus including processing of a substrate as a semiconductor wafer before pattern exposure. Background technique [0002] The semiconductor device has a multilayer wiring structure. In order to form this multilayer wiring structure, in the manufacturing process of a semiconductor device, a semiconductor wafer (hereinafter referred to as wafer) as a substrate is subjected to a plurality of photolithography steps for forming a mask for forming wiring. patterned resist pattern. Between each photolithography step, exposure processing is performed so that a shot is taken on the same region of the wafer. As the wiring of the above-mentioned semiconductor device is refined, it is required to improve the accuracy of alignment between the region imaged in the previous photolithography step and the region imaged in the subsequent photolithography step, that is, the ac...

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Problems solved by technology

Therefore, there is a limit in improving the accuracy of the above-mentioned superimposition

Patent Document 1 describes that a scatterometer (Scatterometer) is used to detect an error related to superimposition, thereby controlling the scanning operation for exposure, but the above-mentioned problem when the wafer is placed on the stage has not been paid attention to. did not solve the problem

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