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Display panel and method for manufacturing display panel

A display panel and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as reduced adhesion, peeling, film peeling, etc., and achieve enhanced mechanical bite force, good contact, The effect of increasing the contact area

Active Publication Date: 2020-04-21
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In order to improve the barrier performance of the inorganic layer, the inorganic layer is generally made denser and smoother, and when the organic layer is in contact with the dense and smooth inorganic layer, the adhesion between the two decreases, and the The organic layer is easy to loosen or even fall off, and the film layer on the inorganic layer will fall off, causing the display panel to fail to display normally

Method used

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  • Display panel and method for manufacturing display panel
  • Display panel and method for manufacturing display panel
  • Display panel and method for manufacturing display panel

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Embodiment Construction

[0024] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0025] Figure 1A is a schematic cross-sectional structure diagram of a display panel provided by an embodiment of the present invention, see Figure 1A , the display panel includes:

[0026] Array substrate 11;

[0027] A plurality of organic light emitting elements 12 are located on one side of the array substrate 11;

[0028] The thin film encapsulation layer, the thin film encapsulation layer is located on the side of the plurality of organic light emitting elements 12 facing away from the array substrate 11 ...

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Abstract

The embodiment of the invention discloses a display panel and a manufacturing method of the display panel. Wherein, the display panel includes: an array substrate; a plurality of organic light emitting elements located on one side of the array substrate; a thin film encapsulation layer located on a side of the plurality of organic light emitting elements away from the array substrate And covering the plurality of organic light-emitting elements, the thin film encapsulation layer includes at least one barrier layer, the surface roughness of the barrier layer is 0-5 nm; at least one layer of the barrier layer is away from one of the array substrates. A rough layer is provided on one side, and the rough layer is in contact with the barrier layer, and the surface roughness of the rough layer is greater than 5 nm. The technical solutions provided by the embodiments of the present invention, on the basis of effectively ensuring reliable packaging of the display panel, firmly bond the film layer above the barrier layer with the barrier layer, solve the problem of film layer peeling, and improve the performance of the display panel.

Description

technical field [0001] Embodiments of the present invention relate to the field of display technology, and in particular, to a display panel and a method for manufacturing the display panel. Background technique [0002] Compared with liquid crystal display panels, OLED (Organic Light Emitting Diode) display panels have the advantages of wide viewing angle, high contrast ratio, thinness, and low power consumption, and are currently one of the development directions of flat panel display technology. [0003] The OLED display panel in the prior art generally includes a substrate, an organic light emitting element on one side of the substrate, a thin film encapsulation layer and some other film layers on the thin film encapsulation layer. The thin film encapsulation layer generally includes stacked inorganic layers and organic layers, mainly relying on the inorganic layer to block moisture and oxygen from entering the organic light-emitting element. In order to improve the bar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/12H10K50/844H10K71/00
Inventor 蔡雨李喜烈刘聪慧于泉鹏
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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