Method for manufacturing busbar circuit board with thick conductor layer

Abstract

The invention belongs to the technical field of busbar manufacturing, and aims to provide a method for manufacturing a busbar circuit board with a thick conductor layer. In the invention, depth-controlled etching and depth-controlled edge milling are respectively performed on a first processing surface and a second processing surface which are oppositely arranged in a conductor layer with required thickness for one time, an insulation bonding layer is laminated to the conductor layer respectively from the first processing surface and the second processing surface so as to process a required busbar, the conductor layer with required thickness is arranged inside a circuit board through combined actions of a series of traditional circuit board manufacturing methods, and the busbar is enabled to have functions of an installation circuit board. In addition, the mode of depth-controlled edge milling is adopted, so that the roughness of the side wall of the conductor layer is increased to a certain degree, thus a binding force between the insulation bonding layer and the conductor layer is ensured, occurrence of undesirable phenomena of board explosion and delamination is reduced as far as possible, and thus manufacturing of a busbar circuit board which is low in production cost, universal and simple in manufacturing process and capable of passing high current can be ensured.

Description

technical field [0001] The invention belongs to the technical field of busbar manufacturing, and more specifically relates to a method for manufacturing a busbar circuit board with a thick conductor layer. Background technique [0002] The so-called busbar is a high-current conductive product used in the power supply system, and its function is basically the same as that of the cable. In the prior art, busbars generally do not have the function of installing circuit boards, and traditional busbars use their metal conductor layers such as copper plates or aluminum plates to connect with other electrical devices. Usually, this wiring method is more complicated and error-prone, not only that , The traditional wiring structure between the busbar and the electrical device occupies a large space and the wiring is relatively complicated. In addition, in order to facilitate the connection of electrical components, traditional busbars are generally processed by mold punching, and ea...

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a method for making a busbar circuit board with a thick conductor layer, which is used to solve the problem that the busbar in the prior art does not have the function of installing a circuit board. When using a thick conductor layer as a busbar, the busbar and The technical problems of high production cost and complex process are caused by poor bonding force between insulating layers, serious etching side erosion effect, and difficulty in forming busbar lines.

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