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Photovoltaic module package

A photovoltaic module and protective layer technology, applied in the field of photovoltaic module packaging, can solve the problems of manufacturing cost, conversion efficiency and efficiency deterioration.

Inactive Publication Date: 2017-07-18
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To this end, manufacturing cost, conversion efficiency, and efficiency degradation are some of the design challenges that need to be addressed

Method used

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  • Photovoltaic module package
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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0158] The conduction of charge in the glass is primarily due to ions in response to an applied voltage. Obtained using established sample preparation protocols and measurement techniques Figure 11 The bulk conductivity of the glass shown in (the bulk conductivity is the reciprocal of the resistivity). The glass samples under test were prepared as described in ASTM D257, wherein a flat sample was lightly shaped to a defined area and thickness, and then gold electrodes were fired on the opposite flat surface to form a parallel plate capacitor. The samples were then electrically connected and placed in an oven as described in ASTM C657. The impedance of the parallel plate electrode sample was measured using an impedance spectrum analyzer, and the conductivity was calculated using the following two descriptions of the resistivity ρ (Ω cm): (1) ρ = R (A / t), where R is the resistance ( Ω), and A and t are the effective area and thickness of the sample respectively; and (2) ρ=ρ0·...

example 2

[0160] Wet leakage test is performed at +600V and stabilized for 2 minutes according to IEC 61215 measurement guidelines. The minimum measurement requirement of the module is 40MΩ·m 2 .

[0161] Table 1

[0162]

[0163] Where "SLG" is a standard soda lime glass front sheet and the back sheet comprises Tedlar polymer. From our measurements it can be seen that the soda lime glass (SLG) / polymer encapsulation passes the IEC requirements. The implemented PV module encapsulation comprised front and back glass sheet compositions of composition 106 (Table 3). The implemented PV module encapsulation passes with a preferred performance margin of >3 orders of magnitude. The higher resistance from the implemented PV package is due in part to the 3 orders of magnitude higher resistivity of glass 106 relative to SLG.

example 3

[0165] A large number of photovoltaic modules were tested for Potential Induced Deterioration ("PID") by damp heat testing to compare the reliability, performance and stability of the embodiments. A standard crystalline Si module was designed to contain all elements of the assembly from Structure 1 or Structure 2 (see Table 4). The modules all consist of a crystalline Si cell, encapsulation coating, front and back sheet assemblies, frame gasket, extruded aluminum frame, junction box and junction box adhesive.

[0166]

[0167] Components from Structure List 1 were used to make five different PV modules: 1) soda lime glass front / polymer back; 2) soda lime glass front / soda lime glass back; 3) composition 106 front / polymer Polymer Backsheet; 4) Composition 106 Front / Soda Lime Glass Backsheet; and 5) Composition 106 Front / Composition 106 Backsheet. Under no bias ( Figure 12A ) and at -1000V bias ( Figure 12B ) perform damp heat measurements for up to 3000 hours. available...

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Abstract

A silicon wafer-based photovoltaic module is described, which includes a first outer protective layer and a second outer protective layer, wherein both outer protective layers comprise a low- or no-sodium glass or low- or no-alkali compositions. The photovoltaic modules show resistance to water ingress, no or reduced potential-induced sodium ion drift, and reduced potential induced degradation.

Description

[0001] This application is a divisional application of an invention patent application with the filing date of August 06, 2012, the application number of 201280042914.3, and the title of "photovoltaic module packaging". [0002] Cross References to Related Applications [0003] This application claims priority under the Patent Act to U.S. Provisional Application No. 61 / 515,042 filed on August 4, 2011 and U.S. Provisional Application No. 61 / 565,050 filed on November 30, 2011 Interest, this application relies on the content of said U.S. Provisional Application, which is hereby incorporated by reference in its entirety. technical field [0004] Embodiments relate to photovoltaic (photovoltaic; PV) modules and processes for photovoltaic modules. Background technique [0005] Photovoltaic modules are used to convert sunlight into electricity. The two main types in use or under development today are wafer-based modules (“wafer-based modules” or “wafer-based silicon modules” or “...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/10C03C3/062C03C3/064C03C3/076C03C3/089C03C3/091
CPCB32B17/10C03C3/062C03C3/064C03C3/076C03C3/089C03C3/091B32B17/10036B32B17/10119B32B17/10302B32B2457/12C03C3/078C03C3/085C03C3/118C03C3/125H01L31/02008H01L31/0488Y02E10/544H01L31/03046H01L31/036H01L31/049
Inventor 布鲁斯·加德纳·艾特肯马克·弗朗西斯·卡洛詹姆士·欧内斯特·韦勃
Owner CORNING INC