Curable silicone composition, method for obtaining thermally conductive cured product and adhesive tape and adhesive film having the cured product

A silicone composition and curable technology, applied in chemical instruments and methods, heat exchange materials, film/sheet adhesives, etc., can solve problems such as inability to adapt to high thermal conductivity and insufficient thermal conductivity, and achieve High reliability, improved manufacturing efficiency, and high thermal conductivity effects

Active Publication Date: 2017-07-21
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity is less than 1W/mK, so it c

Method used

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  • Curable silicone composition, method for obtaining thermally conductive cured product and adhesive tape and adhesive film having the cured product
  • Curable silicone composition, method for obtaining thermally conductive cured product and adhesive tape and adhesive film having the cured product
  • Curable silicone composition, method for obtaining thermally conductive cured product and adhesive tape and adhesive film having the cured product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0105] Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated in more detail, this invention is not limited to a following example.

[0106] Each component used in the following Examples and Comparative Examples is as follows.

[0107] (a) Organopolysiloxane having an alkenyl group

[0108] (a-1) having a dynamic viscosity at 25°C represented by the following formula (a) of 600 mm 2 An organopolysiloxane containing vinyl (Vi) groups at both ends of / s. The number of vinyl groups was 0.015 per 100 g of the organopolysiloxane.

[0109] [chemical 8]

[0110]

[0111] (a-2) The kinematic viscosity at 25°C represented by the formula (a) is 30,000mm 2 An organopolysiloxane containing vinyl (Vi) groups at both ends of / s. The number of vinyl groups was 0.0036 per 100 g of the organopolysiloxane.

[0112] (b) Thermally conductive filler

[0113] Component (b-1) Alumina powder having an average particle diameter of 1 μm, contai...

Embodiment 1～ Embodiment 6 and comparative example 1～ comparative example 5

[0132] The above-mentioned components were prepared in parts by mass described in Table 1 and Table 2, and mixed uniformly to prepare a silicone composition. Mix using a planetary mixer. An appropriate amount of toluene was added to the obtained silicone composition, and it was applied on two PET films surface-treated with a fluorine-based release agent (X-70-201 manufactured by Shin-Etsu Chemical Co., Ltd.). A notched wheel coater was used for the coating. After volatilizing toluene at 80° C., curing was performed at 120° C. for 5 minutes to obtain an adhesive tape having a thermally conductive cured material layer with a thickness of 30 μm and an adhesive tape with a thermally conductive cured material layer with a thickness of 50 μm.

[0133] About each silicone composition, adhesive force and thermal conductivity were measured according to the following method. The results are shown in Table 1 and Table 2.

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Abstract

The invention provides a curable silicone composition, method for obtaining a thermall conductive cured product and an adhesive tape and adhesive film having the cured product, wherein the thermal conductive cured product has expected thermal conductivity and has high adhesive force. The curable silicone composition provided by the invention contains components (a) to (g): (a) 100 parts by mass of organopolysiloxane with alkenyl groups; (b) 4000 to 13000 parts by mass of thermally conductive filler; (c) organohydrogenpolysiloxane, the ratio of the number of hydrogen atoms bonded to silicon atoms in the (c) component to the number of alkenyl groups in the (a) component being 0.5 to 3; (d) a certain amount of addition reaction catalyst; (e) a necessary amount of reaction control agent; (f) 280 to 600 parts by mass of silicone resin; and (g) 80 to 300 parts by mass of compounds having one to three alkoxy groups represented by the following general formula (1) or (2). R<1>R(2)Si(OR<3>)<4-a-b> (1) and the general formula (2) is shown in the description.

Description

technical field [0001] The present invention relates to a heat transfer material that can be interposed between a thermal boundary surface of an exothermic electronic component and an interface of a heat radiating member such as a heat sink or a circuit board for cooling an electronic component. Specifically, the present invention relates to a thermally conductive cured product having thermal conductivity and adhesiveness, and an adhesive tape and an adhesive film including the cured product. Background technique [0002] Transistors and diodes used in electronic equipment such as converters and power supplies, and heat-radiating elements such as Light Emitting Diode (LED) elements used as light sources for lighting or displays It generates a large amount of heat by itself due to the integration and integration. The temperature of the device rises due to the heat generated by the exothermic element, causing problems such as malfunction or damage. Therefore, various heat di...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08L83/04C08K3/22C09K5/14C09J7/02C09J183/04C09J11/08C09J11/06
CPCC09J7/20C09J11/06C09J11/08C09J183/04C09K5/14C08L83/04C08K2201/014C08K2201/003C08L2205/025C08L2205/035C09J2203/326C09J2301/30C09J2301/122C09J2301/408C08K2003/2227C09J7/29C08G77/08C08K3/22C08K2201/005C09J2479/08C08J5/18
Inventor 石原靖久远藤晃洋
Owner SHIN ETSU CHEM IND CO LTD
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